| Back contact silicon thin film chip single resistor SW RSBC Wide resistance range 10W to 1MW Good TCR tracking Available in chip form as bare die All Semiconwell products are available in die form and shipped in waffle packs, Biasing discrete transistors circuits Feedback resistors for amplifiers Chip & wire hybrid circuits Thin film Hybrid circuits Surface mount circuits Semiconwell back contact single thin film silicon chip resistors SWRSBC2000 series are designed to be used for both surface mount applications as well as chip and wire thin film or thick film hybrid circuits from DC to microwave frequencies. SWRSBC2000 thin film resistor chips are manufactured on silicon substrate and designed to satisfy the requirements of prototype development and circuit trimming in hybrid packages through selective wire-bonding. The back contact silicon chip resistors, can be used to build Wheatstone Bridge circuits for low noise instrumentation amplifiers, temperature measurements, sensors circuits, etc. For precision measurements of low value resistors, the Kelvin connection should be used. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. |
| SEMICONWELL
Integrated Passive Networks |
BACK CONTACT SILICON THIN FILM CHIP SINGLE RESISTOR SWRSBC2000-XXX |
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| SHORT PRODUCT APPLICATION NOTE |
| Semiconwell back contact single thin film silicon chip resistors SWRSBC2000 series are designed to be used for both surface mount applications as well as chip and wire thin film or thick film hybrid circuits from DC to microwave frequencies. SWRSBC2000 thin film resistor chips are manufactured on silicon substrate and designed to satisfy the requirements of prototype development and circuit trimming in hybrid packages through selective wire-bonding. The back contact silicon chip resistors, can be used to build Wheatstone Bridge circuits for low noise instrumentation amplifiers, temperature measurements, sensors circuits, etc. For precision measurements of low value resistors, the Kelvin connection should be used. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. |
| SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION |
| Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
| RESISTOR SPECIFICATIONS | ||
| Capacitance [pF] | Tolerance q [%] | Power Rating [mW] |
| <30pF | 1, 5, 10 | 250 mW@70°C |
| Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
| ELECTRICAL CHARACTERISTICS | ||
| PARAMETER | VALUE | UNITS |
| TCR, -55 to +125 °C | max.±100 | ppm/°C |
| Operating Voltage,-55 to +125 °C | max 100 | Vdc |
| Power Rating (per resistor) @70°C (Derate linearly to zero @150°C) | max 250 | mW |
| Thermal Shock, Method 107 MIL-STD-202F | max ±0.5 | % @DR |
| High Temperature Exposure,100Hrs@150°C Ambient | max ±0.25 | % @DR |
| Moisture Resistance, Method 106 MIL-STD-202F | max ±0.5 | % @DR |
| Life, Method 108 MIL-STD-202F (125°C/1000hr) | max ±0.5 | % @DR |
| Noise, Method 308 MIL-STD-202F | max -25 | dB |
| For R>250kW | typ. -20 | dB |
| Tolerance R @25°C | ±1,±5,±10 | % |
| Insulation Resistance @25°C | min 1012 | W |
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| SiO2 / Silicon | 10±2 | 20 x 20 ± 3 | 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier | Au/Si compatible with eutectic and conductive epoxy die attach. |
| All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. | ||||
| CONDUCTORS | RESISTORS | BACKSIDE METAL |
| The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. | Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. | Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only. |
| DIE LAYOUT | PACKAGE PIN OUT |
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| STANDARD PRODUCTS ORDERING INFORMATION |
| SW PART # | TOLERANCE % | QUANTITY | U/P($) |
| SWRSBC2000/RCODE | ±10% | 5000pc | |
| SWRSBC2000/RCODE | ±10% | 10000pc | |
| SWRSBC2000/RCODE | ±5% | 5000pc | |
| SWRSBC2000/RCODE | ±5% | 10000pc | |
| SWRSBC2000/RCODE | ±1% | 5000pc | |
| SWRSBC2000/RCODE | ±1% | 10000pc | |
| For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com. | |||
| Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. |
| Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
| SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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