Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). Generic Edit Space SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE (CSP) SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE SWT-CSP-S, T FILTER, EMI/RFI T-FILTER CHIP SCALE SILICON SWT-CSP-Q, T FILTER, EMI/RFI T-FILTER CHIP SCALE QUARTZ SWTF-CSP-S, TAPPED EMI/RFI FILTERS, CHIP SCALE SILICON SWTF-CSP-Q, TAPPED EMI/RFI FILTERS, CHIP SCALE QUARTZ SWT-CSP-C, T FILTER, EMI/RFI T-FILTER CHIP SCALE CERAMIC SWTVS-CSP TRANSIENT VOLTAGE SUPRESSORS CHIP SCALE SWTF-CSP-C, TAPPED EMI/RFI FILTERS, CHIP SCALE CERAMIC SWRG-CSP GTL/ECL TERMINATION CHIP SCALE CERAMIC SWPIESD-CSP CRC ESD PROTECTED PI FILTERS CHIP SCALE SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE

Integrated Passive Networks


Four channels of EMI filtering
Includes 1 channel of ESD-only protection
Greater than 30dB attenuation at 1GHz
+8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge), +15kV ESD protection on each channel (HBM)
Supports bipolar signals—ideal for audio applications
Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance, 11-bump, 2.045mm X 1.437mm footprint Chip Scale Package (CSP)
EMI filtering and ESD protection for audi o ports
Wireless Handsets
Wireless Handsets
Handheld PCs / PDAs
MP3 Players, Digital Camcorders
Notebooks, Desktop PCs

SWPIESD-CSP is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the SWPIESD-4 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The SWPIESD-4 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight.

Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

Reverse voltage VR Continuous IF IFRM for tw<100ms Max Power dissipation
15V 100mA 200 mA (20%duty cycle) 500mW@70°C/channel

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

Storage Temperature Range
-65 to +150
Operating Temperature Range
-40 to +85
DC Power per Resistor
DC Package Power Rating
Resistance Tolerance
Capacitance Tolerance

Signal Voltage, Positive Clamp,I LOAD = 10mA
Signal Voltage,Negative Clamp

min.5 ; typ.7; max.15


In-system ESD Withstand Voltage,Notes 2,4 and 5
a) Human Body Model, MIL-STD-883,Method 3015
b) Contact Discharge per IEC 61000-4-2 Level 4



Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV;Notes 2,3,4 and 5
Positive Transients
Negative Transients

typ. +15
typ. -19



Note 1: T A =25°C unless otherwise specified
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design and characterization.

Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 / Silicon 10±2 90 x 60 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

The protection diodes use solid state silicon avalanche technology and are characterized by their high surge capability, low operating and clamping voltages, fast response time and low leakage current Ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.

layout / design pending schematic
Vss=die backside


R1(W) C1(pF) R2(W) C2(pF) SW PART#
100 47 10 100 SWPIESD-CSP/R101/C470/R100/C102

Semiconwell P/N Quantity E-mail    

Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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