Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). Generic Edit Space SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE (CSP) SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE SWT-CSP-S, T FILTER, EMI/RFI T-FILTER CHIP SCALE SILICON SWT-CSP-Q, T FILTER, EMI/RFI T-FILTER CHIP SCALE QUARTZ SWTF-CSP-S, TAPPED EMI/RFI FILTERS, CHIP SCALE SILICON SWTF-CSP-Q, TAPPED EMI/RFI FILTERS, CHIP SCALE QUARTZ SWT-CSP-C, T FILTER, EMI/RFI T-FILTER CHIP SCALE CERAMIC SWTVS-CSP TRANSIENT VOLTAGE SUPRESSORS CHIP SCALE SWTF-CSP-C, TAPPED EMI/RFI FILTERS, CHIP SCALE CERAMIC SWRG-CSP GTL/ECL TERMINATION CHIP SCALE CERAMIC SWPIESD-CSP CRC ESD PROTECTED PI FILTERS CHIP SCALE SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE

Integrated Passive Networks
  GTL/ECL Termination
Chip Scale Ceramic


8 Bit, 16 Bit, and 32 BitTermination Sets
Compliant for GTL, GTL+, and AGTL+ Termination
Excellent High Frequency Performance
Slim BGA Package
1% Resistor Tolerance
Low Channel to Channel Cross Talk
GTL, GTL+, and AGTL+ busses.

SWRG-CSP is a integrated termination network for GTL, GTL+, and AGTL+ busses. The circuit design combined with a ceramic substrate virtually eliminates cross talk between channels that is common in other termination networks and resistor arrays.

Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

Capacitance [pF] Tolerance q [%] Power Rating [mW]
<0.20pF 1, 5, 10 50 mW@70°C

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

Resistor Tolerance
MaximumResistor Power,at 70°C
Temperature Coefficient of Resistance
Operating Temperature Range
-55°C to +125

Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
Al2O3 99.6 % 10±2 90 x 60 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Resistive material is ultra stable TaN with low TCR <75ppm/C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only.

layout / design pending schematic
Vss=die backside


25 250 8 SWRG/250-CSP8
25 250 16 SWRG/250-CSP16
25 250 32 SWRG/250-CSP32
56 560 8 SWRG/560-CSP8
56 560 16 SWRG/560-CSP16
56 560 32 SWRG/560-CSP32
150 151 8 SWRG/151-CSP8
150 151 16 SWRG/151-CSP16
150 151 32 SWRG/151-CSP32

SW PART # QUANTITY CSP-8 U/P($) CSP-16 U/P($) CSP-32 U/P($)
SWRG/RCCODE-10%   5,000pc -CSP8   -CSP16   -CSP32  
SWRG/RCCODE-10% 10,000pc -CSP8   -CSP16   -CSP32  
SWRG/RCCODE-5%      5,000pc -CSP8   -CSP16   -CSP32  
SWRG/RCCODE-5%    10,000pc -CSP8   -CSP16   -CSP32  
SWRG/RCCODE-1%      5,000pc -CSP8   -CSP16   -CSP32  
SWRG/RCCODE-1%    10,000pc -CSP8   -CSP16   -CSP32  
For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact

Semiconwell P/N Quantity E-mail    

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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