| FEATURES |
| APPLICATIONS |
| SCHEMATIC |
| Minimal cross-talk |
| 4 Filter lines per devices. |
| Ultra small foot print. |
| Silicon substrate. |
| 0.35 mm Eutectic Solder Bumps. |
| Cellular Phones |
| Cordless Phones |
| Internet Appliance |
| Laptop Computers |
| Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). Generic Edit Space SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE (CSP) SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE SWT-CSP-S, T FILTER, EMI/RFI T-FILTER CHIP SCALE SILICON SWT-CSP-Q, T FILTER, EMI/RFI T-FILTER CHIP SCALE QUARTZ SWTF-CSP-S, TAPPED EMI/RFI FILTERS, CHIP SCALE SILICON SWTF-CSP-Q, TAPPED EMI/RFI FILTERS, CHIP SCALE QUARTZ SWT-CSP-C, T FILTER, EMI/RFI T-FILTER CHIP SCALE CERAMIC SWTVS-CSP TRANSIENT VOLTAGE SUPRESSORS CHIP SCALE SWTF-CSP-C, TAPPED EMI/RFI FILTERS, CHIP SCALE CERAMIC SWRG-CSP GTL/ECL TERMINATION CHIP SCALE CERAMIC SWPIESD-CSP CRC ESD PROTECTED PI FILTERS CHIP SCALE SEMICONWELL PRODUCTS AVAILABLE IN CHIP SCALE PACKAGE |
| SEMICONWELL
Integrated Passive Networks |
Tapped EMI/RFI Filters, CHIP SCALE SILICON SW TF-CSP-S |
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| SHORT PRODUCT APPLICATION NOTE |
| Many portable applications frequentely demand filtering of signals in the 800-2,700 MHz band. Semiconwell's thin film Flip Chip filters provide a minimum of -30dB of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. Ground-bounce and cross-talk are minimum via a die design that provides two solder bump contacts to the common suply connection. The solder bumps are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in diameter. |
| SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION |
| Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
| RESISTOR SPECIFICATIONS | ||
| Capacitance [pF] | Tolerance q [%] | Power Rating [mW] |
| <5pF | 1, 5, 10 | 50 mW@70°C |
| Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
| ELECTRICAL CHARACTERISTICS | ||
| PARAMETER | VALUE | UNITS |
| Resistor |
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| Absolute Tolerance, R |
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| Capacitor |
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| Absolute Tplerance, C |
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| TCR of Resistor |
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| Operating Temperature range |
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| Leakage Current@±6V |
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| Power Rating/Resistor |
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| Fc with 0W Source impedance and infinite Load impedance |
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| Fc with 50W Source impedance and 50W Load impedance |
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| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| Si / Silicon | 10±2 | 90 x 60 ±3 | 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier | Au/Si compatible with eutectic and conductive epoxy die attach. |
| All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. | ||||
| CONDUCTORS | RESISTORS | BACKSIDE METAL |
| The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. | Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. | Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only. |
| DIE LAYOUT | PACKAGE PIN OUT |
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| IN=A1,A2,A3,A4,A5 | |
| OUT=B1,B2,B3,B4,B5 | |
| GND=C1-C5 | |
| GND=DIE BACKSIDE | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| STANDARD VALUES | CUT OFF FREQUENCY | PART MARKING | |||
| R(W) ± 10% | C(pF) ± 10% | fc @ 3dB (MHz) | SW PART# | RC CODE | Tol 10% |
| 100 | 39 | 41 | SWTF-CSP-S | /101/390 | -10% |
| SW PART # | QUANTITY | CSP | U/P($) | BARE DIE | U/P($) |
| SWTF-CSP-S/101/390-10% | 5,000pc | - | -BD | ||
| SWTF-CSP-S/101/390-10% | 10,000pc | - | -BD | ||
| For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com | |||||
| Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. |
| Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
| SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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