SW DLPT05 DATA LINE PROTECTION DEVICE FEATURES 300 Watts Peak Pulse Power (tp = 8x20ms) Transient Protection for data line to IEC61000-4-2 level 4 (ESD), 8kV HBM, and IEC 61000-4-4 (EFT)) Low Leakage Current Surface Mount Package Ideally Suited for Automatic Insertion Also Available in Lead Free Version SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. ABSOLUTE MAXIMUM RATINGSTA = 25 °C unless otherwise specified PARAMETER VALUE UNITS Peak Pulse Power (tp=8x20ms) 300 W Peak Forward Voltage (IPP=1A, tp=8x20ms) 2.1 V Diode Peak Repetitive Reverse Voltage 75 V TstgStorageTemperature Range -55 to +150 °C TambOperating Ambient Temperature Range -55 to +150 °C Tjjunction temperature max. +150 °C THERMAL CHARACTERISTICS PER DEVICE Rth j-athermal resistance from junction to ambient. 417 °C/W Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTICS,TVS Element, Tamb =25°C unless specified. PARAMETER VALUE UNITS Reverse Standoff Voltage,VRWM 5 V Breakdown Voltage,IT=1 mA min.6 V Reverse Leakage at VRWM max.20 mA Clamping Voltage,Ipp=-1A, note 3 max.9.8 V Peak Pulse Current, note 2 max.17 A Total Capacitance, note 1 typ. 1.9 pF Note 1:VR = 0V, f = 1MHZ from line to be protected to ground pin. Note 2:tp = 8x20ms. Note 3:Clamping voltage values are based on an 8x20ms peak pulse current (Ipp) waveform. GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal Silicon 0.5 1 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach. All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. SEMICONDUCTORS RESISTORS CAPACITORS All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. Ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is 5%. Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V. DIE LAYOUT PACKAGE PIN OUT STANDARD PRODUCTS ORDERING INFORMATION SOT23 SOT323 SC70 SOT89 SC90 BARE DIE SW DLPT05-SOT23 SW DLPT05-SOT323 SW DLPT05-SC70 SW DLPT05-SOT89 SW DLPT05-SC90 SW DLPT05-BD SW PART # QUANTITY SOT-23 U/P($) SOT-323 U/P($) SC-70 U/P($) SOT-89 U/P($) SC-90 U/P($) BARE DIE U/P($) SW DLPT05 5,000pc -SOT23 -SOT323 -SC70 -SOT89 -SC90 -BD SW DLPT05 10,000pc -SOT23 -SOT323 -SC70 -SOT89 -SC90 -BD List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONWELL technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONWELL at any time and without notice. For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com Semiconwell P/N Quantity E-mail Receive Instant Quote -14SO -14TS -10CSP Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

 
 
SEMICONWELL
Integrated Passive Networks
  DATA LINE PROTECTION DEVICE
SW DLPT05
 
 

FEATURES
APPLICATIONS
SCHEMATIC
300 Watts Peak Pulse Power (tp = 8x20ms)
Transient Protection for data line to IEC61000-4-2 level 4 (ESD), 8kV HBM, and IEC 61000-4-4 (EFT))
Low Leakage Current
Surface Mount Package Ideally Suited for Automatic Insertion
Also Available in Lead Free Version

SHORT PRODUCT APPLICATION NOTE
Integrated clamp Schottky diode network is a low power and low noise solution for reducing reflections on high speed data lines. Reflection on high speed data lines leads to undershoot and overshoot disturbances which may result in improper system operation. Resistor terminations used in parallel or in series with the outputs, when used to terminate high speed data lines, can increase power consumption, degrade the high level output and lower noise immunity or increase propagation delays. Schottky diode termination is the best overall solution for applications in which power consumption and noise immunity are critical considerations. Clamp Schottky diode networks provide optimized lead inductance and parasitic capacitive effects (see added ground pins), improved forward voltage and crosstalk attributes, and best termination performance characteristics at high data transmission rates.

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

ABSOLUTE MAXIMUM RATINGSTA = 25 °C unless otherwise specified
PARAMETER VALUE UNITS
Peak Pulse Power (tp=8x20ms)
300 W
Peak Forward Voltage (IPP=1A, tp=8x20ms)
2.1 V
Diode Peak Repetitive Reverse Voltage
75 V
TstgStorageTemperature Range
-55 to +150
°C
TambOperating Ambient Temperature Range
-55 to +150
°C
Tjjunction temperature
max. +150
°C
THERMAL CHARACTERISTICS PER DEVICE
Rth j-athermal resistance from junction to ambient.
417
°C/W

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS,TVS Element, Tamb =25°C unless specified.
PARAMETER VALUE UNITS
Reverse Standoff Voltage,VRWM
5
V
Breakdown Voltage,IT=1 mA
min.6
V
Reverse Leakage at VRWM
max.20
mA
Clamping Voltage,Ipp=-1A, note 3
max.9.8
V
Peak Pulse Current, note 2
max.17
A
Total Capacitance, note 1
typ. 1.9
pF

Note 1:VR = 0V, f = 1MHZ from line to be protected to ground pin.
Note 2:tp = 8x20ms.
Note 3:Clamping voltage values are based on an 8x20ms peak pulse current (Ipp) waveform.


GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
Silicon ±0.5 ±1 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

SEMICONDUCTORS RESISTORS CAPACITORS
All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. Ultra stable TaN with low TCR <75ppm/C typical. For Rsq<10W/sq and Rsq>500W/sq, resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.

DIE LAYOUT PACKAGE PIN OUT
Vin=3,4,5,6,11,12,13,14
Vss=die backside
Vss=1,8,9,16
Vdd=2,7,10,15

STANDARD PRODUCTS ORDERING INFORMATION

SOT23 SOT323 SC70 SOT89 SC90 BARE DIE
SW DLPT05-SOT23 SW DLPT05-SOT323 SW DLPT05-SC70 SW DLPT05-SOT89 SW DLPT05-SC90 SW DLPT05-BD

SW PART # QUANTITY SOT-23 U/P($) SOT-323 U/P($) SC-70 U/P($) SOT-89 U/P($) SC-90 U/P($) BARE DIE U/P($)
SW DLPT05   5,000pc -SOT23    -SOT323    -SC70    -SOT89   -SC90   -BD  
SW DLPT05 10,000pc -SOT23    -SOT323    -SC70    -SOT89   -SC90   -BD  
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONWELL technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONWELL at any time and without notice.
For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

  Semiconwell P/N Quantity E-mail    
Receive Instant Quote
 

Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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Last update: July 18, 2013
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