| FEATURES |
| APPLICATIONS |
| SCHEMATIC |
| Suitable for I/O interface cards |
| 8 EMI/RFI protection lines/package |
| Stable resistor-capacitor network |
| Saves board space and component cost |
| ESD protection > 2kV |
| EMI/RFI Filters |
| Low pass filters |
| RS232 Serial Port Filter |
| ESD Protected CRC PI Filter Network Suitable for I/O interface cards Multiple EMI/RFI protection lines/package Stable resistor-capacitor network Saves board space and component cost ESD protection > 2kV EMI/RFI Filters Low pass filters RS232 Serial Port Filter These integrated thin film resistor-networks is designed to suppress EMI/RFI noise at I/O ports of personal computers and peripherals, workstations, Local Area Network (LAN), Asynchronous Transfer Mode (ATM), Wide Area Network (WAN), etc. The filter includes ESD protection circuitry witch prevents device destruction when subjected to ESD discharges of up to 5kV. The ESD protection circuitry permits the filter to operate on bipolar signals of up to +12V. These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high-speed data lines. The TESD series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self-passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multi-chip module applications. In packaged form, these products are the best solution where space and weight are a concern. Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). |
| SEMICONWELL
Integrated Passive Networks |
ESD Protected CRC PI Filter Network SWPIESD XXX/XXX-20 |
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| SHORT PRODUCT APPLICATION NOTE |
| These integrated thin film resistor-networks is designed to suppress EMI/RFI noise at I/O ports of personal computers and peripherals, workstations, Local Area Network (LAN), Asynchronous Transfer Mode (ATM), Wide Area Network (WAN), etc. The filter includes ESD protection circuitry witch prevents device destruction when subjected to ESD discharges of up to 5kV. The ESD protection circuitry permits the filter to operate on bipolar signals of up to +12V. These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high-speed data lines. The TESD series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self-passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multi-chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
| SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION |
| Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
| ABSOLUTE MAXIMUM RATINGS | |||
| Reverse voltage VR | Continuous IF | IFRM for tw<100ms | Max Power dissipation |
| 7V | 100mA | 200 mA (20%duty cycle) | 100mW@70°C/channel |
| Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
| R(W) ± 10% | C(pF) ± 10% | fc @ 3dB (MHz) | SW PART# |
| 33 | 47 | 103 | SWPIESD/330/470 |
| 47 | 47 | 72 | SWPIESD/470/470 |
| 47 | 33 | 103 | SWPIESD/470/330 |
| 50 | 180 | 18 | SWPIESD/500/181 |
| 55 | 22 | 103 | SWPIESD/550/220 |
| 75 | 50 | 42 | SWPIESD/750/500 |
| 100 | 100 | 16 | SWPIESD/101/101 |
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| SiO2 / Silicon | 10±2 | 90 x 60 ±3 | 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier | Au/Si compatible with eutectic and conductive epoxy die attach. |
| All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. | ||||
| DIODES | RESISTORS | CAPACITORS |
| Schottky diodes offer basic ESD protection, with low forward voltage, low leakage and low power dissipation in OFF state. Schottky Diodes exhibit low junction capacitance CTand low on resistance RDON. | Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. | Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V. |
| DIE/PACKAGE LAYOUT | SCHEMATIC DIAGRAM |
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| OUT=19,18,17,16,15,14,13,12 | |
| IN=2,3,4,5,6,7,8,9 | |
| Vss=1,10,11,20 | |
| Vss=die backside | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| R* | C** | fc@3Db [MHz] | SOIC-20 | QSOP-20 | TQSOP-20 | TSSOP-20 | BARE DIE-20 | |
| 47 | 33 | 198 | SWPIESD/470/330-20SO | SWPIESD/470/330-20QS | SWPIESD/470/330-20TQS | SWPIESD/470/330-20TS | SWPIESD/470/330-20BD | |
| * Units W. Tolerance ±10% | ||||||||
| ** Units pF. Tolerance ±20% | ||||||||
| SW PART # | QUANTITY | SOIC-20 | U/P($) | QSOP-20 | U/P($) | TQSOP-20 | U/P($) | TSSOP-20 | U/P($) | BARE DIE | U/P($) |
| SWPIESD/RCCODE-10% | 5,000pc | -20SO | -20QS | -20TQS | -20TS | -20BD | |||||
| SWPIESD/RCCODE-10% | 10,000pc | -20SO | -20QS | -20TQS | -20TS | -20BD | |||||
| SWPIESD/RCCODE-5% | 5,000pc | -20SO | -20QS | -20TQS | -20TS | -20BD | |||||
| SWPIESD/RCCODE-5% | 10,000pc | -20SO | -20QS | -20TQS | -20TS | -20BD | |||||
| SWPIESD/RCCODE-1% | 5,000pc | -20SO | -20QS | -20TQS | -20TS | -20BD | |||||
| SWPIESD/RCCODE-1% | 10,000pc | -20SO | -20QS | -20TQS | -20TS | -20BD | |||||
| For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com | |||||||||||
| Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. |
| Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
| SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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