Six channels of ESD protection ±8kV contact, ±15 kV air ESD protection perper channel (IEC 61000-4-2 standard) ±15 kV of ESD protection per channel (HBM) Low loading capacitance (3pF typical) Available in miniature 8-pin MSOP or SOIC pack-ages Low leakage current—ideal for battery-powered devices Consumer electronic products Cellular phones PDAs Notebook computers Desktop PCs Digital cameras and camcorders The SWDN006 is a diode array designed to provide 6 channels of ESD protection for electronic components or sub-systems. Each channel consists of a pair of diodes which steers an ESD current pulse to either the positive (V P ) or negative (V N ) supply. The SWDN006 protects against ESD pulses up to 15kV Human Body Model (100 pF capacitor discharging through a 1.5KW resistor), and 8kV contact discharge, per International Standard IEC 61000-4-2. This device is particularly well-suited for portable electronics (e.g., cellular phones, PDAs, notebook computers) because of its small package footprint, high ESD protection level, and low loading capacitance. It is also suitable for protecting video output lines and I/O ports in computers and peripherals and is ideal for a wide range of consumer electronics products. Integrated passive networks are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and are ideal for high reliability hybrid and multi chip module applications.

 
 
SEMICONWELL
Integrated Passive Networks
  6 CHANNEL ESD PROTECTION ARRAY
SWJDN006
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Six channels of ESD protection
±8kV contact, ±15 kV air ESD protection perper channel (IEC 61000-4-2 standard)
±15 kV of ESD protection per channel (HBM)
Low loading capacitance (3pF typical)
Available in miniature 8-pin MSOP or SOIC pack-ages
Low leakage current—ideal for battery-powered devices
Consumer electronic products
Cellular phones
PDAs
Notebook computers
Desktop PCs
Digital cameras and camcorders
schematic
7 - VP, 3 - VN

SHORT PRODUCT APPLICATION NOTE
The SWDN006 is a diode array designed to provide 6 channels of ESD protection for electronic components or sub-systems. Each channel consists of a pair of diodes which steers an ESD current pulse to either the positive (V P ) or negative (V N ) supply. The SWDN006 protects against ESD pulses up to 15kV Human Body Model (100 pF capacitor discharging through a 1.5KW resistor), and 8kV contact discharge, per International Standard IEC 61000-4-2. This device is particularly well-suited for portable electronics (e.g., cellular phones, PDAs, notebook computers) because of its small package footprint, high ESD protection level, and low loading capacitance. It is also suitable for protecting video output lines and I/O ports in computers and peripherals and is ideal for a wide range of consumer electronics products.

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

ABSOLUTE MAXIMUM RATINGS
Maximum Supply Voltage Maximum IF Max Power dissipation
6V 20mA 350mW@70°C/package

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

STANDARD SPECIFICATIONS
PARAMETER VALUE UNITS
DC Voltage at any channel input (VN-0.5) to (VP+0.5) V
Supply Current (IP) VP - VN = 5.5 V max. 10 µA
Diode Forward Voltage (VF) IF = 20 mA 0.65(min.) 0.95(max.) V
ESD Protection (VESD)
Peak Discharge Voltage at any channel input, in system (Note 3)
a)
Human Body Model, MIL-STD-883, Method 3015 (Notes 2,4)
b)
Contact Discharge per IEC 61000-4-2 (Note 5)


±15
±8


kV
V
Channel Clamp Voltage (VCL) @15kV ESD HBM
Positive Transients
Negative Transients

VP + 13.0
VN - 13.0

V
V
Channel Leakage Current (ILEAK) 0.1(typ.) 1.0(max.) µA
Channel Input Capacitance @ 1 MHz, VP=5v, Vn=0, Vin=2.5V (Note2) 3 (typ.) 5 (max.) pF
Operating Temperature Range -40 to +85 °C
Storage Temperature Range -65 to +150 °C
 
Note 1: All parameters specified at T A =25°C unless otherwise noted.
Note 2: These parameters guaranteed by design and characterization.
Note 3: From I/O pins to VP or VN only; VP bypassed to VN with 0.2 mF ceramic capacitor
Note 4: Human Body Model per MIL-STD-883, Method 3015, CDischarge=100pF RDischarge=1.5KW VP=5V, VNgorunded
Note 5: Standard IEC 61000-4-2 with CDischarge=150pF RDischarge=330W VP=5V, VNgorunded

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 / Silicon 10±2 90 x 60 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 4-6 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

DIODES BONDING PADS CAPACITORS
Junction diodes offers basic ESD protection, with low forward voltage and low power dissipation. Diodes are small physically resulting low junction capacitance and low loading capacitance, tipically <5pF. The bonding pads are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.

DIE / PACKAGE LAYOUT PACKAGE PIN OUT
layout / design pending schematic
7 - VP, 3 - VN
I/O=1,2,4,5,6,8
VN=die backside
VN=3
VP=7

STANDARD PRODUCTS ORDERING INFORMATION

CODE SOIC-8 TSSOP-8 BARE DIE
SWJDN006 SWJDN006-8SO SWJDN006-8TS SWJDN006-8BD

SW PART # QUANTITY SOIC-8 U/P($) TSSOP-8 U/P($) BARE DIE U/P($)
SWJDN006   5,000pc -8SO   -8TS   -8BD  
SWJDN006 10,000pc -8SO   -8TS   -8BD  
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONWELL technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONWELL at any time and without notice.
For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

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Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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Last update: July 18, 2013
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