| PACDN007 compatible, SWJDN007 diode array is pin compatible with PACDN007. Eighteen 18 channels of ESD protection ±20 kV of ESD protection per channel (HBM) ±15 kV contact ESD protection per channel (IEC 61000-4-2 standard) Low loading capacitance—7pF typical Parallel printer port protection Notebook computers Desktop PCs The SWJDN007 is a diode array designed to provide 18 channels of ESD protection for electronic components or subsystems. Each channel consists of a pair of diodes which steers the ESD current pulse either to the positive (VP ) or negative (VN ) supply. The SWJDN007 protects against ESD pulses up to 20kV Human Body Model (100 pF capacitor discharging through a 1.5KW resistor), and 15kV contact discharge, per International Standard IEC 61000-4-2. This device is particularly well-suited to provide ESD protection for parallel printer and I/O ports. It exhibits low loading capacitance for all signal lines. Integrated passive networks are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and are ideal for high reliability hybrid and multi chip module applications. |
| SEMICONWELL
Integrated Passive Networks |
18 CHANNEL ESD PROTECTION ARRAY SWJDN007 |
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 1,12,13,24 - VP, 7,18 - VN |
| SHORT PRODUCT APPLICATION NOTE |
| The SWJDN007 is a diode array designed to provide 18 channels of ESD protection for electronic components or subsystems. Each channel consists of a pair of diodes which steers the ESD current pulse either to the positive (VP ) or negative (VN ) supply. The SWJDN007 protects against ESD pulses up to 20kV Human Body Model (100 pF capacitor discharging through a 1.5KW resistor), and 15kV contact discharge, per International Standard IEC 61000-4-2. This device is particularly well-suited to provide ESD protection for parallel printer and I/O ports. It exhibits low loading capacitance for all signal lines. |
| SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION |
| Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
| ABSOLUTE MAXIMUM RATINGS | ||
| Maximum Supply Vvoltage (VP-VN) | Maximum IF | Max Power dissipation |
| 6V | 40mA | 1000mW@70°C/package |
| Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
| STANDARD SPECIFICATIONS | ||
| PARAMETER | VALUE | UNITS |
| DC Voltage at any channel input | (VN-0.5) to (VP+0.5) | V |
| Supply Current (IP) (VP -VN )=5.5V | 10 | mA |
| Diode Forward Voltage (VF) IF = 20mA | (min.) 0.65 (max.) 0.95 | V |
| Channel Leakage Current (ILEAK) | (typical) ±0.1 (max.) ±1.0 | mA |
| Channel Input Capacitance(CIN)@1MHz, VP=5V, VN=0V, VIN=2.5V; (Note2 applies) | (typical) 7 (max.) 12 | pF |
| ESD Protection (VESD) Peak Discharge Voltage at any chanel input, in system (Note3) |
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| a) Human Body Model, MIL-STD883 Method 3015 (Notes2, 4) | ±20 | KV |
| b) Contact discharge per IEC 61000-4-2 standard (Note5) | ±15 | KV |
| Channel Clamp Voltage(VCL)@20kV ESD HBM; (Notes2 & 4) Positive Transients Negative Transients |
VP + 13.0 VN - 13.0 |
V V |
| Operating Temperature Range | -40 to +85 | °C |
| Storage Temperature Range | -65 to +150 | °C |
| Note 1: All parameters specified at TA =25°C unless otherwise noted. Note 2: These parameters guaranteed by design and characterization. Note 3: From I/O pins to VP or VN only; VP bypassed to VN with 0.2mF ceramic capacitor Note 4: Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KW,VP = 5.0V, VN grounded. Note 5: Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330KW, VP = 5.0V, VN grounded. |
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| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| SiO2 / Silicon | 10±2 | 90 x 60 ±3 | 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier | Au/Si compatible with eutectic and conductive epoxy die attach. |
| All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 4-6 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. | ||||
| DIODES | BONDING PADS | CAPACITORS |
| Junction diodes offers basic ESD protection, with low forward voltage and low power dissipation. Diodes are small physically resulting low junction capacitance and low loading capacitance, tipically <5pF. | The bonding pads are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. | Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V. |
| DIE / PACKAGE LAYOUT | PACKAGE PIN OUT |
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1,12,13,24 - VP, 7,18 - VN |
| VI/O=2,3,4,5,6,8,9,10,11,14,15,16,17,19,20,21,22,23 | |
| VN=die backside | |
| VN=7,18 | |
| VP=1,12,13,24 | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| CODE | QSOP-24 | TQSOP-24 | TSSOP-24 | BARE DIE |
| SWJDN007 | SWJDN007-24QS | SWJDN007-24TQS | SWJDN007-24TS | SWJDN007-24BD |
| SW PART # | QUANTITY | QSOP-24 | U/P($) | TQSOP-24 | U/P($) | TSSOP-24 | U/P($) | BARE DIE | U/P($) |
| SWJDN007 | 2500pc | -24QS | $1.04 | -24TQS | $1.04 | -24TS | $1.04 | -24BD | $0.81 |
| For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com | |||||||||
| Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. |
| Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
| SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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