CMD (California Micro Devices) PACDN004 same as SWDN0023, CMD (California Micro Devices) CM1208 same as SWDN00XX - High-Speed ESD Protection Arrays, 2,4,8 CHANNELS 3pF ESD PROTECTION DIODE NETWORKS manufactured by SEMICONWELL
Multiple channels of ESD protection Very low loading capacitance, 3pF typical +6 kV ESD protection per channel (IEC 61000-4-2 standard) Available in SOT326 and SC70 package USB 2.0 ports at 480Mbps IEEE1394 Firewire ports at 400 Mbps Gigabit Ethernet ports Flat panel display interfaces Wireless antennas General purpose high-speed data line ESD protection The SWDN00X3 family of diode array have been designed to provide ESD protection for electronic components or sub-systems requiring minimal capacitive loading. These devices are ideal for protecting systems with high data and clock rates or for circuits requiring low capacitive loading. Each ESD channel consists of a pair of diodes which will steer the ESD current pulse to either the positive (VP) or negative (VN) supply rail. The SWDN will protect against ESD pulses up to +6kV per
the IEC61000-4-2 standard.This device is particularly well-suited for systems using high-speed port implementations such as USB2.0, IEEE1394, (Firewire,i.Link), Gigabit Ethernet and corresponding ports in removable storage, digital camcorders, DVD-RW drives and other applications where extremely low loading capacitance with ESD protection are required in a small package footprint. Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter
networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW).