Isolated inductor network Important reduction of the DCR High quality factor High SRF, PRF High Q oscillators Filters RF choke in power supplies The Lxx-xxnH-20Q Series of chip inductors are designed to be used as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. U.S. Microwaves's advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25m m, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. The dimensions of the die are 0.050"x0.050"x0.020". The Lxx-20Q inductors are manufactured on quartz (SiO2), 20 mils thick. Integrated passive networks are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and are ideal for high reliability hybrid and multi chip module applications. Direct Current Resistance (DCR) 0.1(min.) 11.25(max.) W Quality Factor (Q) 25.5(min) 29.9(max.) Self Resonance Frequency (SRF) 4.18(min.) 93(max.) GHz Paralel Resonant Frequency 5.68(min.) 46.1(max.) GHz SEMICONWELL Advanced Integrated Passive Networks Isolated inductor network SWLI4 FEATURES APPLICATIONS Important reduction of the DCR High quality factor High SRF, PRF High Q oscillators Filters RF choke in power supplies PRODUCT DESCRIPTION The Lxx-xxnH-20Q Series of chip inductors are designed to be used as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. U.S. Microwaves's advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25m m, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. The dimensions of the die are 0.050"x0.050"x0.020". The Lxx-20Q inductors are manufactured on quartz (SiO2), 20 mils thick. SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and are ideal for high reliability hybrid and multi chip module applications. SUBSTRATE INFORMATION RESISTOR SPECIFICATIONS Material Thickness (mil) Min. die size (mils) Power rating Tolerance q % Capacitance SiO2 / Silicon 20&plusmn;1 40 x 40 &plusmn;3 50 mW@70°C 10 <0.030pF CONDUCTORS BACKSIDE METALS The bonding pads of the resistors are 3&micro;m thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only. SCHEMATIC DIE LAYOUT ELECTRICAL CHARACTERISTICS PARAMETER VALUE UNITS Direct Current Resistance (DCR) 0.1(min.) 11.25(max.) W Quality Factor (Q) 25.5(min) 29.9(max.) Self Resonance Frequency (SRF) 4.18(min.) 93(max.) GHz Paralel Resonant Frequency 5.68(min.) 46.1(max.) GHz

 
 
SEMICONWELL
Integrated Passive Networks
  4 ISOLATED INDUCTOR NETWORK
SWLI4
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Important reduction of the DCR
High quality factor
High SRF, PRF
High Q oscillators
Filters
RF choke in power supplies
schematic

SHORT PRODUCT APPLICATION NOTE
The Lxx-xxnH-20Q Series of chip inductors are designed to be used as RF choke in power supplies and microwave circuit resonant elements. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. U.S. Microwaves's advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25m m, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. The dimensions of the die are 0.050"x0.050"x0.020". The Lxx-20Q inductors are manufactured on quartz (SiO2), 20 mils thick.

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW]
<0.030pF 10 50 mW@70°C

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Direct Current Resistance (DCR) 0.1(min.) 11.25(max.) W
Quality Factor (Q) 25.5(min) 29.9(max.)  
Self Resonance Frequency (SRF) 4.18(min.) 93(max.) GHz
Paralel Resonant Frequency 5.68(min.) 46.1(max.) GHz

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 / Silicon 20±1 160 x 40 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

CONDUCTORS BACKSIDE METAL
The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only.

DIE LAYOUT PACKAGE PIN OUT
layout schematic
Inductor Central pad = 1,4,7,10
End of spiral pad =20, 17, 14, 11
Vss=1,8,9,16
Vdd=2,7,10,15

STANDARD PRODUCTS ORDERING INFORMATION

L(nH) N (turns) QSOP-20 TSSOP-20 BARE DIE
0.35 1 SWLI/0P35-QS20 SWLI/0P35-TS20 SWLI/0P35-BD
2 2 SWLI/2P0-QS20 SWLI/2P0-TS20 SWLI/2P0-BD
4 3 SWLI/4P0-QS20 SWLI/4P0-TS20 SWLI/4P0-BD
8 4 SWLI/8P0-QS20 SWLI/8P0-TS20 SWLI/8P0-BD
14 5 SWLI/14P0-QS20 SWLI/14P0-TS20 SWLI/14P0-BD
21 6 SWLI/21P0-QS20 SWLI/21P0-TS20 SWLI/21P0-BD
30.6 7 SWLI/30P6-QS20 SWLI/30P6-TS20 SWLI/30P6-BD
40.2 8 SWLI/40P2-QS20 SWLI/40P2-TS20 SWLI/40P2-BD
50 9 SWLI/50P0-QS20 SWLI/50P0-TS20 SWLI/50P0-BD
62 10 SWLI/62P0-QS20 SWLI/62P0-TS20 SWLI/62P0-BD
74 11 SWLI/74P0-QS20 SWLI/74P0-TS20 SWLI/74P0-BD
87.5 12 SWLI/87P5-QS20 SWLI/87P5-TS20 SWLI/87P5-BD
106.25 13 SWLI/106P25-QS20 SWLI/106P25-TS20 SWLI/106P25-BD
125 14 SWLI/125P0-QS20 SWLI/125P0-TS20 SWLI/125P0-BD
143.75 15 SWLI/143P75-QS20 SWLI/143P75-TS20 SWLI/143P75-BD
162.5 16 SWLI/162P5-QS20 SWLI/162P5-TS20 SWLI/162P5-BD
181.25 17 SWLI/181P25-QS20 SWLI/181P25-TS20 SWLI/181P25-BD
200 18 SWLI/200P0-QS20 SWLI/200P0-TS20 SWLI/200P0-BD
219 19 SWLI/219P0-QS20 SWLI/219P0-TS20 SWLI/219P0-BD
237.5 20 SWLI/237P5-QS20 SWLI/237P5-TS20 SWLI/237P5-BD
256.25 21 SWLI/256P25-QS20 SWLI/256P25-TS20 SWLI/256P25-BD

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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