MILLIPAQ is a JEDEC compliant QFN plastic package. This near CSP package is available in Micro (MILLIPAQM), Quad (MILLIPAQQ), and Dual (MILLIPAQD). The Dual technology allows the ability to provide foot print compatible replacements for SOIC, SSOP, TSSOP, and MSOP packages based on customer needs. The MILLIPAQs have an exposed die attach pad that provides an effective thermal path when soldered to a Printed Circuit Board (PCB), therefore providing a cost effective thermal enhancement as well as improved electrical performance. This small thin package is an ideal choice for applications where weight, size and high performance are required. Devices are typically used in applications for mobile phones, PDAs, GPS, and RF products. |
SEMICONWELL
Integrated Passive Networks |
MILLIPAQ MICRO PACKAGE
MILLIPAQ |
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PACKAGE OUTLINE |
SHORT PACKAGE DESCRIPTION |
MILLIPAQ (Micro Package) is a JEDEC compliant QFN plastic package. This near CSP package is available in Micro (MILLIPAQM), Quad (MILLIPAQQ), and Dual (MILLIPAQD). The Dual technology allows the ability to provide foot print compatible replacements for SOIC, SSOP, TSSOP, and MSOP packages based on customer needs. The MILLIPAQs have an exposed die attach pad that provides an effective thermal path when soldered to a Printed Circuit Board (PCB), therefore providing a cost effective thermal enhancement as well as improved electrical performance. This small thin package is an ideal choice for applications where weight, size and high performance are required. Devices are typically used in applications for mobile phones, PDAs, GPS, and RF products. |
MILLIPAQ MICRO PACKAGE 80 PINS | ||
JEDEC # | MO-154BC | |
TYPE | 80 LEAD | |
SYMBOL | Min. | Max. |
A | 0.059 | 0.069 |
A1 | 0.004 | 0.008 |
B | 0.0067 | 0.009 |
C | 0.005 | 0.008 |
D | 0.803 | 0.811 |
E | 0.150 | 0.157 |
e | 0.197 BSC | |
H | 0.228 | 0.244 |
h | 0.010 | 0.016 |
L | 0.023 | 0.029 |
a° | 0° | 8° |
Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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