MLP (Micro Leadframe Package) is a JEDEC compliant QFN plastic package. This near CSP package is available in Micro (MLPM), Quad (MLPQ), and Dual (MLPD). The Dual technology allows the ability to provide foot print compatible replacements for SOIC, SSOP, TSSOP, and MSOP packages based on customer needs. The MLPs have an exposed die attach pad that provides an effective thermal path when soldered to a Printed Circuit Board (PCB), therefore providing a cost effective thermal enhancement as well as improved electrical performance. This small thin package is an ideal choice for applications where weight, size and high performance are required. Devices are typically used in applications for mobile phones, PDAs, GPS, and RF products.
IC Packaging services for Semiconwell board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.