| FEATURES |
| APPLICATIONS |
| SCHEMATIC |
| Saves board space and component cost |
| Integrated resistor-capacitor-diode network. |
| Highly effective termination on controlled and uncontrolled line impedances. |
| EMI/RFI filter. |
| ESD protection for keyboard/mouse port. |
| PACGAME1 compatible FILTER/PROTECTION CIRCUIT SWG1 MIDI/GAME PORT Saves board space and component cost EMI/RFI filter Integrated resistor-capacitor-diode network. ESD protection for keyboard/mouse port Highly effective termination on controlled and uncontrolled line impedances. SHORT PRODUCT APPLICATION NOTE The signals from the MIDI/Game-port controller contain high frequency EMI signals that must be reduced before the connector. Likewise, the signals from the MIDI/Game-port controller must be protected from any possible charges such as static electricity. The SWG1 provides filtering and pull-up termination of the Game Port as well as ESD protection.These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high speed data lines. The series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multichip module applications. In package form, these products are the best solution where space and weight are a concern. SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. STANDARD SPECIFICATIONS R1 4.7K R2 47 R3 2.2K C 470pF Resistor Tolerance ±10% Capacitor Tolerance ±20% Operating Temperature Range -55°C to 125°C ESD Protection (Human Body Model) MIL-STD-883, Method 3015 (Note 1)>4KV In System Protection (Note 2) >8KV Peak Discharge Voltage at any I/O, Human Body Model, Method 3015 (Note 1) -4KV to +4KV In System Protection, HBM (Note 2) -8KV to +8KV In System Protection, IEC 1000-4-2, Level 2 (Note 2, 3) -4KV to +4KV Channel Clamp Voltage @ 8 KV ESD Pulses, HBM (Note 1, 2) -30KV to +30KV Note1: Human Body Model per MIL-STD-883, Method 3015. CDischarge=100 pF, RDischarge=1.5KW pins 11 and 14 @ 5 V and pins 1, 6, 12, 13, 19, 24 @ ground. Note 2: Pins 1, 6, 12, 13, 19, 24 grounded, pins 11 and 14 to VCC all other pins are open. ESD contact discharge between and pins 2 3, 4, 5, 15, 16, 17, 18, 20, 21, 22, 23, one at a time. Note 3: Standard IEC 1000-4-2 with CDischarge=150 pF, RDischarge=330W pins 11 and 14 @ 5 V and pins 1, 6, 12, 13, 19, 24 @ ground. |
| SEMICONWELL
Integrated Passive Networks |
FILTER/PROTECTION CIRCUIT SWG1 MIDI/GAME PORT |
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| SHORT PRODUCT APPLICATION NOTE |
| The signals from the MIDI/Game-port controller contain high frequency EMI signals that must be reduced before the connector. Likewise, the signals from the MIDI/Game-port controller must be protected from any possible charges such as static electricity. The SWG1 provides filtering and pull-up termination of the Game Port as well as ESD protection.These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high speed data lines. The series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multichip module applications. In package form, these products are the best solution where space and weight are a concern. |
| SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION |
| Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
| ABSOLUTE MAXIMUM RATINGS | |||
| Reverse voltage VR | Continuous IF | IFRM for tw<100ms | Max Power dissipation |
| 7V | 100mA | 200 mA (20%duty cycle) | 100mW@70°C/channel |
| Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
| STANDARD SPECIFICATIONS | |
| R1 | 4.7KW |
| R2 | 47 |
| R3 | 2.2KW |
| C | 470pF |
| Resistor Tolerance | ±10% |
| Capacitor Tolerance | ±20% |
| Operating Temperature Range | -55°C to 125°C |
| ESD Protection (Human Body Model) | |
| MIL-STD-883, Method 3015 (Note 1) | >4KV |
| In System Protection (Note 2) | >8KV |
| Peak Discharge Voltage at any I/O, Human Body Model, Method 3015 (Note 1) | -4KV to +4KV |
| In System Protection, HBM (Note 2) | -8KV to +8KV |
| In System Protection, IEC 1000-4-2, Level 2 (Note 2, 3) | -4KV to +4KV |
| Channel Clamp Voltage @ 8 KV ESD Pulses, HBM (Note 1, 2) | -30KV to +30KV |
| Note1:
Human Body Model per MIL-STD-883, Method 3015. CDischarge=100 pF, RDischarge=1.5KW
pins 11 and 14 @ 5 V and pins 1, 6, 12, 13, 19, 24 @ ground. Note 2: Pins 1, 6, 12, 13, 19, 24 grounded, pins 11 and 14 to VCC all other pins are open. ESD contact discharge between and pins 2 3, 4, 5, 15, 16, 17, 18, 20, 21, 22, 23, one at a time. Note 3: Standard IEC 1000-4-2 with CDischarge=150 pF, RDischarge=330W pins 11 and 14 @ 5 V and pins 1, 6, 12, 13, 19, 24 @ ground.. |
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| PIN OUT | |||
| PIN# | FUNCTION | PIN# | FUNCTION |
| 1 | NC | 15 | NC |
| 2 | NC | 16 | JRC0 IN |
| 3 | JOY3 OUT | 17 | JRC1 IN |
| 4 | JOY2 OUT | 18 | JRC2 IN |
| 5 | JOY1 OUT | 19 | JRC3 IN |
| 6 | JOY0 OUT | 20 | MIDI CODEC OUT |
| 7 | SELECT | 21 | MIDI CODEC IN |
| 8 | MIDI CODEC OUT | 22 | SELECT |
| 9 | MIDI CODEC IN | 23 | JOY0 IN |
| 10 | JRC3 OUT | 24 | JOY1 IN |
| 11 | JRC2 OUT | 25 | JOY2 IN |
| 12 | JRC1 OUT | 26 | JOY3 IN |
| 13 | JRC0 OUT | 27 | NC |
| 14 | NC | 28 | NC |
| GENERAL DIE INFORMATION | ||||
| Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
| SiO2 / Silicon | 10±2 | 90 x 60 ±3 | 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier | Au/Si compatible with eutectic and conductive epoxy die attach. |
| All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. | ||||
| DIODES | RESISTORS | CAPACITORS |
| Diodes offers basic ESD protection, with low forward voltage and low power dissipation. Diodes are small physically resulting low junction capacitance and low loading capacitance. | Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. | Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V. |
| DIE LAYOUT | PACKAGE PIN OUT |
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| Vin=3,4,5,6,11,12,13,14 | |
| Vss=die backside | |
| Vss=1,8,9,16 | |
| Vdd=2,7,10,15 | |
| STANDARD PRODUCTS ORDERING INFORMATION |
| SW PART# | QSOP-28 | TSSOP-28 | BARE DIE |
| SWG1 | SWG1-28QS | SWG1-28TS | SWG1-28BD |
| SW PART # | QUANTITY | QSOP-28 | U/P($) | TSSOP-28 | U/P($) |
| SWG1 | 5,000pc | -28QS | -28TS | ||
| SWG1 | 10,000pc | -28QS | -28TS | ||
| For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com | |||||
| Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. |
| Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
| SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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