|SWKBME IS SAME AS PACKBME, PAC KBME, KEYBOARD/MOUSE PORT INTERFACE FILTER PROTECTION Stable resistor-capacitor network. Integrated solution. Saves board space and reduces assembly cost. ESD protection diodes. EMI/RFI filter. Pull-Up termination. ESD protection for keyboard/mouse port. The signals from the keyboard/mouse controller contain high frequency EMI signals that must be reduced before the connector. Likewise, that signals from the keyboard/mouse controller must be protected from any possible external charges such as static electricity. EMI/RFI filters are used to suppress noise at low high frequencies of the signals in the be-directional parallel communication between PC’s and peripherals. The RCD series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multichip module applications. In package form, these products are the best solution where space and weight are a concern..Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). Generic Edit Space COMPANION PASSIVE ARRAYS FOR COMPUTER PERIPHERALS SEMICONWELL PASSIVE ARRAYS FOR COMPUTER PERIPHERALS SWPCAC97 - AC97 AUDIO COMPANION RESISTOR NETWORK SWKBMEE - KEYBOARD/MOUSE PORT INTERFACE SWG1 - MIDI/GAME PORT FILTER/PROTECTION SWKBMEU - KEYBOARD/MOUSE/USB FILTER PROTECTION SWGTL - GTL TERMINATION FOR 370 SOCKET PROCESSOR SWMEMB - MEMORY BUS TERMINATOR DDR/RAMBUS SW1284 - IEEE 1284 PARALLEL PORT TERMINATION SWVGA - VGA PORT ESD PROTECTED TERMINATION SWKBME - KEYBOARD/MOUSE FILTER PROTECTION SWUSB - USB UP/DOWN STREAM PORT FILTERS ESD PROTECTION SEMICONWELL PASSIVE ARRAYS FOR COMPUTER PERIPHERALS
Integrated Passive Networks
KEYBOARD/MOUSE PORT INTERFACE
|SHORT PRODUCT APPLICATION NOTE
|TheSWKBME is a single-channel keyboard or mouse port termination device. The SWKBME integrates EMI/RFI filter components R1 and C1, and also incorporates two pull-up resistors R2. In addition, it provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The I/O pins and the V DD pin are designed and characterized to safely dissipate ESD strikes of 30kV, well beyond the maximum requirements set in the IEC 61000-4-2 international standard. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, the I/O pins and the V DD pin are also protected for contact discharges of 30kV.
|SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
|Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.
|ABSOLUTE MAXIMUM RATINGS
|Diode clampoing voltage
|Resistor power rating
|Max Power dissipation
|Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.
|Capacitance C1 @ 0V DC, 1MHz
|Diode Stand-off Voltage, I = 10µA
|Positve Clamp, 10mA
|Negative Clamp, 10mA
|Human Body Model (MIL-STD-883D, method 3015)
|IEC 61000-4-2, contact discharge method
|Clamping Voltage During ESD Discharge* Positive
|MIL-STD-883D (Method 3015), 8kV Negative
|DC Power per Resistor:
|Package Power Rating:
|* ESD applied to input/output/V DD pins with
respect to GND, one at a time.
Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin (ie: if ESD is applied to pin 1, then clamping
voltage is measured at pin 6). Unused pins are open.
These parameters guaranteed by design.
|GENERAL DIE INFORMATION
|Die size (mils)
|SiO2 / Silicon
|x x y±3
|4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier
|Au/Si compatible with eutectic and conductive epoxy die attach.
|All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.
|Diodes offers basic ESD protection, with low forward voltage and low power dissipation. Diodes are small physically resulting low junction capacitance and low loading capacitance.
|Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%.
|Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.
|PACKAGE PIN OUT
|STANDARD PRODUCTS ORDERING INFORMATION
|SW PART #
|For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact email@example.com
|Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.
|Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.
|SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.