CSPLVDSA same as SWLVDSA-CSP SDRAM-DDR Termination
Array Chip Scale Package Ceramic manufactured by SEMICONWELL CHIP SCALE
FOR SDRAM - DDR TERMINATION ARRAY SWDDR-CSP FEATURES 16 Integrated High
Frequency Series/Parallel Terminations Ultra small footprint Chip Scale
Package Ceramic substrate 0.35 mm Eutectic Solder Bumps, 1.27mm Pitch APPLICATIONS
DDR Memory bus termination SSTL Termination SHORT PRODUCT APPLICATION NOTE
The SWDDR1A-CSP is a high performance integrated Passive Device which provides
Series/Parallel terminations suitable for use in SSTL and DDR termination
applications. Sixteen Series/Parallel termination channels are provided
for a total of 32 integrated resistors. These resistors provide excellent
high frequency performance in excess of 3 GHz and are manufactured to an
absolute tolerance of ±1%. The Chip Scale Package provides an ultra small
footprint for this Integrated Passive Devices and provides minimal parasitics
compared toconventional packaging. Typical bumps inductance is less than
25pH. The large solder bumps and ceramic substrate allow for standard attachment
to laminate printed circuit boards without the use of underfill. The 4x9
Bump pattern is arranged for easy flow through routing on the pcb. SEMICONDUCTOR-THIN
FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured
using advanced thin film technologies including ultra -stable and self passivating
Tantalum Nitride resistors, gold interconnect metallization and reliable
MNOS capacitors to achieve excellent uniformity, performance and reliability.
Thin film resistor technology is the preferred solution for all applications
that require low noise, long term stability and excellent performance at
very high frequencies. Semiconwell employs proprietary thin film technologies
for deposition of a wide range of sheet resistance films from 1 W/sq to
10,000 W/sq. All Semiconwell's products are available in die form and as
KGD, known good die and are ideal for high reliability hybrid and multi
chip module applications. Besides thin film resistors, Semiconwell integrates
capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive
and active networks are manufactured using Semiconwell's in house high reliability
semiconductor manufacturing processes. All semiconductor devices employ
precision doping via ion implantation, silicon nitride junction passivation,
platinum silicided contacts and gold interconnect metallization for best
performance and reliability. MNOS capacitors and Tantalum Nitride resistors
are easily integrated with Schottky diodes to provide complete standard
and custom RCD solutions. In die form, these products are ideal for hybrid
and multi chip module applications. In packaged form, these products are
the best solution where space and weight are a concern. RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW] <0.20pF 1, 5, 10 100
mW@70°C Stresses beyond listed absolute maximum ratings may cause permanent
damage to the device. ELECTRICAL CHARACTERISTICS PARAMETER VALUE UNITS Resistor
Value R1=25 ; R2=50 W Resistor Tolerance ±1.0 % MaximumResistor Power,at
70°C 0.1 W Temperature Coefficient of Resistance ±100 ppm/°C Operating Temperature
Range -40°C to +85 °C GENERAL DIE INFORMATION Substrate Thickness (mils)
Die size (mils) Bonding pads Backside metal Al2O3 99.6 % 15±2 228x96±3 4x4
mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible
with eutectic and conductive epoxy die attach. All Semiconwell products
are available in die form for chip and wire hybrid circuits and multi chip
modules applications. Typical delivery for standard die products is 3-4
weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an
update on availability of certain products. CONDUCTORS RESISTORS BACKSIDE
METAL 0.35mm Dia. Bumps Resistive material is ultra stable TaN with low
TCR <75ppm/°C typical. For Rsq<10/sq and Rsq>500W/sq, the resistive
material is proprietary. Power rating/resistor max 100mW for R<1KW and
25mW for R>1KW. Standard tolerance is ±5%. DIE LAYOUT PACKAGE PIN OUT
Vtt= A5, B5, C5, D5 IN = B/D 1..9 OUT = A/C 1..9 STANDARD PRODUCTS ORDERING
INFORMATION R1(W) R2(W) CSP BARE DIE 25 50 SWDDR100/250/500-CSP SWDDR100/250/500-BD
SW PART # QUANTITY CSP U/P($) BARE DIE U/P($) SWDDR100/250/500-1% 5,000pc
-CSP -BD SWDDR100/250/500-1% 5,000pc -CSP -BD
For custom products sold as bare tested die or known good die KGD, minimum
order is 5000pc. Dice are 100% functional tested, visual inspected and shipped
in antistatic waffle packs. For special die level KGD requirements, different
packaging or custom configurations, contact sw_sales@semiconwell.com INSTANT
QUOTE Semiconwell P/N Quantity E-mail SWDDR/250/500 -5% -1% -CSP -BD Delivery
for packaged Resistor networks standard products is 4-6 weeks ARO. Certain
items may be available from stock. For standard products available from
stock, there is a minimum line item order of $250.0. Inventory is periodically
updated. For 2500pc or larger orders, all surface mount packaged devices
are shipped in tape on reel (T/R). For smaller quantities, it may vary.
Samples are available only for customers that have issued firm orders pending
qualification of product in a particular application. On line Orders have
to be verified, accepted and acknowledged by Semiconwell sales department
in writing before, becoming non cancelable binding contracts. Semiconwell
guarantees continuous supply and availability of any of it's standard products
provided minimum order quantities are met. SEMICONWELL has made every effort
to have this information as accurate as possible. However, no responsibility
is assumed by SEMICONWELL for its use, nor for any infringements of rights
of third parties which may result from its use. SEMICONWELL reserves the
right to revise the content or modify its product line without prior notice.
SEMICONWELL products are not authorized for and should not be used within
support systems which are intended for surgical implants into the body,
to support or sustain life, in aircraft, space equipment, submarine, or
nuclear facility applications without the specific written consent. Home
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