PACRAMBUS-1 is same as SEMICONWELL - SWRMB high performance GTL termination network for socket 370 processor and is pin compatible with PACRAMBUS-1. Stable resistor network 24 Terminations in single package 5 Chip solution for all 119 GTL Terminations High speed termination network Saves board space and reduces assembly cost Center ground pin placement reduces ground bounce and eases board layout Parallel termination Servers, Desk Top Systems Intel Pentium CPUs These integrated thin film resistor-networks is designed to suppress EMI/RFI noise at I/O ports of personal computers and peripherals, workstations, Local Area Network (LAN), Asynchronous Transfer Mode (ATM), Wide Area Network (WAN), etc. The filter includes ESD protection circuitry witch prevents device destruction when subjected to ESD discharges of up to 5kV. The ESD protection circuitry permits the filter to operate on bipolar signals of up to +12V. These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high-speed data lines. The TESD series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self-passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multi-chip module applications. In packaged form, these products are the best solution where space and weight are a concern. Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). Generic Edit Space COMPANION PASSIVE ARRAYS FOR COMPUTER PERIPHERALS SEMICONWELL PASSIVE ARRAYS FOR COMPUTER PERIPHERALS SWPCAC97 - AC97 AUDIO COMPANION RESISTOR NETWORK SWKBME - KEYBOARD/MOUSE PORT INTERFACE SWG1 - MIDI/GAME PORT FILTER/PROTECTION SWKBMU - KEYBOARD/MOUSE/USB FILTER PROTECTION SWRMB - GTL TERMINATION FOR 370 SOCKET PROCESSOR SWRMB - MEMORY BUS TERMINATOR DDR/RAMBUS SW1284 - IEEE 1284 PARALLEL PORT TERMINATION SWVGA - VGA PORT ESD PROTECTED TERMINATION SWKBM - KEYBOARD/MOUSE FILTER PROTECTION SWUSB - USB UP/DOWN STREAM PORT FILTERS ESD PROTECTION SEMICONWELL PASSIVE ARRAYS FOR COMPUTER PERIPHERALS

 
 
SEMICONWELL
Integrated Passive Networks
  HIGH PERFORMANCE MEMORY BUS TERMINATION NETWORK
SWRMB/R280-20
 
 

FEATURES
APPLICATIONS
SCHEMATIC
2 chip solutions for all memory bus load terminations in 20 pin package
14 Terminations in single package
1% absolute tolerance 28 ohms terminations across temperature range
Center ground pin reduces ground bounce noise and eases board layout
Verry low cross talk
Saves board space and reduces assembly cost
Memory bus
schematic

SHORT PRODUCT APPLICATION NOTE
The memory interface transfers data at both edges of a 400MHz clock resulting in an 800M Hz transfer rate. The memory channel uses a memory controller on one end of the bus, terminations at the other end, and the memory modules in between. The memory channel contains control signals and data bus lines that must be terminated in order to prevent any reflections. SEMICONWELL's SWRMB integrates fourteen 28 ohm resistors specified at 1% absolute tolerance across the commercial temperature range.
This termination network provides high performance, high reliability, and low cost through manufacturing efficiency. The termination resistor elements are fabricated using state-of-the-art thin film manufacturing. This integrated solution is silicon based and has the same reliability characteristics as any of today's microprocessor products. The thin film resistors have very high stability over temperature, over applied voltage, and over life. In addition, the QSOP industry standard packaging is easy to handle in manufacturing and yields a high reliability similar to other semiconductor components..

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW]
<5pF 1 40 mW@70°C/resistor

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

STANDARD SPECIFICATIONS
PARAMETER VALUE UNITS
Resistor (R)

28

W
Tolerance (R) (0 to 70 °C) ±1 %
TCR ±150 ppm
Operating Temperature Range 0 to 70 °C
Power rating per resistor 40 mW
Maximum Package Power rating (70 °C) 1 W

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 / Silicon 10±2 60 x 40±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

CONDUCTORS RESISTORS BACKSIDE METAL
The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only.

DIE LAYOUT PACKAGE PIN OUT
layout schematic

STANDARD PRODUCTS ORDERING INFORMATION

R(W)±1% R CODE SOIC-20 QSOP-20 TQSOP-20 TSSOP-20 BARE DIE
28 280 SWRMB/R280-20SO SWRMB/R280-20QS SWRMB/R280-20TQS SWRMB/R280-20TS SWRMB/R280-20BD

SW PART # QUANTITY SOIC-20 U/P($) QSOP-20 U/P($) TQSOP-20 U/P($) TSSOP-20 U/P($) BARE DIE U/P($)
SWMEMB/R280-1%   5,000pc -20SO   -20QS   -20TQS   -20TS   -20BD  
SWRMB/R280-1% 10,000pc -20SO   -20QS   -20TQS   -20TS   -20BD  
For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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