PAC002SPFQ same as SWRSP002 - 1% TOLERANCE SERIES/PARALLEL TERMINATION NETWORK pin to pin compatible with PAC002SPFQ 1% TOLERANCE SERIES/PARALLEL TERMINATION NETWORK SWRSP002 FEATURES Minimal Ground Bounce, Cross-Talk 6 Termination lines Stable 1% Absolute Tolerance elements Miniature 16-pin package APPLICATIONS High speed server and workstation terminations (DDR,SSTL, and NTL) SHORT PRODUCT APPLICATION NOTE The SWRST002 is a series/parallel termination network which provides 6 terminating channels per package and optimizes signal integrity by reducing reflections and ringing. The termination is ideal for use in NTL busses. The devices features a flow through design for the series terminations. The resistors are trimmed to a tight absolute tolerance of 1%, which provides tight impedance-matching and results in greatly reduced reflections The SWRST002 - series/parallel termination network provides high performance, superior reliability and low coast through manufacturing efficiency. The integrated solution is silicon-based and has the same reliability characteristics as any of today's microprocessor products. The thin film resistors have excellent stability over temperature, applied voltage and life. SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. RESISTOR SPECIFICATIONS Capacitance [pF] Tolerance q [%] Power Rating [mW] <0.20pF 1 100 mW@70C ELECTRICAL CHARACTERISTICS Resistor Values, R1& R2 R1=22;R2=90 Resistor Tolerance, R1&R2 1.0 % Ratio Tolerance 1.0 % MaximumResistor Power,at 70C 0.1 W Crosstalk typ. 20 mV Temperature Coefficient of Resistance 100 ppm/C Storage Temperature Range -65C to +150 C Operating Temperature Range -55C to +125 C GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal SiO2/Silicon 102 3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach. All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. CONDUCTORS RESISTORS BACKSIDE METAL The bonding pads of the resistors are 3m thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400C in air without loss of adhesion. Resistive material is ultra stable TaN with low TCR <75ppm/C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is 5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only. DIE LAYOUT PACKAGE PIN OUT IN = 1,2,4,5,7,8 OUT=16,15,13,12,10,9 3,7,11,14 STANDARD PRODUCTS ORDERING INFORMATION R(ohm) R(ohm) R CODE QSOP-16 22 90 /R220/R900 SWRSP002/R220/R900-16QS SW PART # QUANTITY QSOP-16 U/P($) BARE DIE U/P($) SWRSP002/R220/R900-1%-16QS 5,000pc -QS16 -BD SWRSP002/R220/R900-1%-16QS 10,000pc -QS16 -BD For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

 
 
SEMICONWELL
Integrated Passive Networks
  1% TOLERANCE SERIES/PARALLEL TERMINATION NETWORK
SWRSP002
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Minimal Ground Bounce, Cross-Talk
6 Termination lines
Stable 1% Absolute Tolerance elements
Miniature 16-pin package
High speed server and workstation terminations (DDR,SSTL, and NTL)

SHORT PRODUCT APPLICATION NOTE
The SWRST002 is a series/parallel termination network which provides 6 terminating channels per package and optimizes signal integrity by reducing reflections and ringing. The termination is ideal for use in NTL busses. The devices features a flow through design for the series terminations. The resistors are trimmed to a tight absolute tolerance of 1%, which provides tight impedance-matching and results in greatly reduced reflections The SWRST002 - series/parallel termination network provides high performance, superior reliability and low coast through manufacturing efficiency. The integrated solution is silicon-based and has the same reliability characteristics as any of today's microprocessor products. The thin film resistors have excellent stability over temperature, applied voltage and life..

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW]
<0.20pF 1 100 mW@70°C

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Resistor Values, R1&R2
R1=22;R2=90
W
Resistor Tolerance, R1&R2
±1.0
%
Ratio Tolerance
±1.0
%
MaximumResistor Power,at 70°C
0.1
W
Crosstalk
typ. 20
mV
Temperature Coefficient of Resistance
±100
ppm/°C
Storage Temperature Range
-65°C to +150
°C
Operating Temperature Range
-55°C to +125
°C

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2/Silicon 10±2 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

CONDUCTORS RESISTORS BACKSIDE METAL
The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Resistive material is ultra stable TaN with low TCR <75ppm/C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only.

DIE LAYOUT PACKAGE PIN OUT
layout / design pending
IN = 1,2,4,5,7,8
OUT=16,15,13,12,10,9

STANDARD PRODUCTS ORDERING INFORMATION

R(W) R(W) R CODE QSOP-16
22 90 /R220/R900 SWRSP002/R220/R900-16QS

SW PART # QUANTITY QSOP-16 U/P($) BARE DIE U/P($)
SWRSP002/R220/R900-1%-16QS   5,000pc -QS16   -BD  
SWRSP002/R220/R900-1%-16QS 10,000pc -QS16   -BD  
For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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