SW1402 same as CM1402 manufactured by Semiconwell SIM CARD EMI FFILTER ARRAY WITH ESD PROTECTION CHIP SCALE SILICON SIM Card EMI Filter Array with ESD Protection, CHIP SCALE SILICON SW1402-CSP FEATURES APPLICATIONS Three channels of EMI filtering, each with ESD protection SIM Card slot in mobile handsets Two additional channels of ESD-only protection EMI filtering for data ports in cell phones, PDAs or notebook computers 10kV ESD protection (IEC 61000-4-2, contact discharge) on all pins I/O port protection for mobile handsets, notebook computers, PDAs, etc. 25kV ESD protection (HBM). Greater than 30dB of attenuation at 1GHz. 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) SHORT PRODUCT APPLICATION NOTE Many portable applications frequentely demand filtering of signals in the 800-2,700 MHz band. Semiconwell's thin film Flip Chip filters provide a minimum of -30dB of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. Ground-bounce and cross-talk are minimum via a die design that provides two solder bump contacts to the common suply connection. The solder bumps are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in diameter.The parts include avalanchetype ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of 10kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than 25kV. SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. RESISTOR SPECIFICATIONS Capacitance 5pF Tolerance 10% Power Rating [mW] 25mW@70°C Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTICS,Note 1 PARAMETER VALUE UNITS Resistor R1=100;R2=47 ohms Absolute Tolerance, R 10 % Capacitor 20 pF Absolute Tplerance, C 20 % TCR of Resistor 100 ppm Operating Temperature range -40 to +85 °C Leakage Current@BIAS 3.3V max.1 mA Power Rating/Resistor 25 mW Stand-off Voltage ,I = 10A typ.6.0 V Signal Voltage,Positive Clamp,ILOAD = 10mA min.5.6, typ.6.8, max.9 V Signal Voltage,Negative Clamp,ILOAD = -10mA min.-1.5,typ.-0.8,max.-0.4 V In-system ESD Withstand Voltage,Human Body Model, MIL-STD-883,Method 3015,Notes 2,4 and 5 min. 15 KV In-system ESD Withstand Voltage,b) Contact Discharge per IEC,61000-4-2,Notes 2,4 and 5 min. 10 KV Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015),8kV Positive Transients,Notes 2,3,4 and 5 max.+12 V Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015),8kV Negative Transients,Notes 2,3,4 and 5 max.-7 V Cut-off frequency ZSOURCE = 50W, ZLOAD = 50W,R = 100W, C = 20pF 77 MHz Cut-off frequency ZSOURCE = 50W, ZLOAD = 50W,R = 47W, C = 20pF 85 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Si / Silicon 152 77 x 523 pure tin Sn or SnPb solder All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. CONDUCTORS RESISTORS BACKSIDE METAL not applicable 0.35 diameter bumps 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) solder bumps. Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is 5%.

 
 
SEMICONWELL
Integrated Passive Networks
  SIM Card EMI Filter Array with ESD Protection, CHIP SCALE SILICON
SW1402-CSP
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Three channels of EMI filtering, each with ESD protection
Two additional channels of ESD-only protection
±10kV ESD protection (IEC 61000-4-2, contact discharge) on all pins
±25kV ESD protection (HBM).
Greater than 30dB of attenuation at 1GHz.
10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP)
SIM Card slot in mobile handsets
EMI filtering for data ports in cell phones, PDAs or notebook computers
I/O port protection for mobile handsets, notebook computers, PDAs, etc.

SHORT PRODUCT APPLICATION NOTE
Many portable applications frequentely demand filtering of signals in the 800-2,700 MHz band. Semiconwell's thin film Flip Chip filters provide a minimum of -30dB of attenuation over this frequency band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. Ground-bounce and cross-talk are minimum via a die design that provides two solder bump contacts to the common suply connection. The solder bumps are a 63/37 Sn/Pb alloy and are nominally 0.35 mm in diameter.The parts include avalanchetype ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components
that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate
ESD strikes of ±10kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25kV..

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW]
<5pF 10 25 mW@70°C

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS,Note 1
PARAMETER VALUE UNITS
Resistor
R1=100;R2=47
W
Absolute Tolerance, R
±10
%
Capacitor
20
pF
Absolute Tplerance, C
±20
%
TCR of Resistor
±100
ppm
Operating Temperature range
-40 to +85
°C
Leakage Current@BIAS 3.3V
max.1
mA
Power Rating/Resistor
25
mW
Stand-off Voltage ,I = 10µA
typ.6.0
V
Signal Voltage,Positive Clamp,ILOAD = 10mA
min.5.6, typ.6.8, max.9
V
Signal Voltage,Negative Clamp,ILOAD = -10mA
min.-1.5,typ.-0.8,max.-0.4
V
In-system ESD Withstand Voltage,Human Body Model, MIL-STD-883,Method 3015,Notes 2,4 and 5
min.± 15
KV
In-system ESD Withstand Voltage,b) Contact Discharge per IEC,61000-4-2,Notes 2,4 and 5
min.± 10
KV
Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015),8kV Positive Transients,Notes 2,3,4 and 5
max.+12
V
Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015),8kV Negative Transients,Notes 2,3,4 and 5
max.-7
V
Cut-off frequency ZSOURCE = 50W, ZLOAD = 50W,R = 100W, C = 20pF
77
MHz
Cut-off frequency ZSOURCE = 50W, ZLOAD = 50W,R = 47W, C = 20pF
85
MHz

Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design.


GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads
Si / Silicon 15±2 77 x 52±3 pure tin Sn or SnPb solder
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

CONDUCTORS RESISTORS BACKSIDE METAL
0.30mm diameter bumps
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) solder bumps.
Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. not applicable

CASE LAYOUT PACKAGE PIN OUT
IN=A1,A2,A3,A4
OUT=C1,C2,C3,C5
GND=B1,B2
Vdd=2,7,10,15

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD VALUES   PART MARKING
R1(W) 10% R2(W) 10% C(pF) 10% SW PART# RC CODE Tol 10%
100 47 20 SW1402-CSP /101/470/200 -10%

SW PART # QUANTITY CSP U/P($) BARE DIE U/P($)
SW1402/101/470/200-CSP   5,000pc -   -BD  
SW1402/101/470/200-CSP 10,000pc -   -BD  
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONWELL technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONWELL at any time and without notice.
For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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Last update: July 18, 2013
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