SEMICONWELL - SWPIEMI200-CSP CSPEMI200a, 4 CHANNEL MICROPHONE AND HEADSET EMI FILTER

SWPIEMI200-CSP CSPEMI200a, 4 CHANNEL MICROPHONE AND HEADSET EMI FILTER 4 CHANNEL MICROPHONE AND HEADSET EMI FILTER SWPIEMI200-CSP FEATURES APPLICATIONS SCHEMATIC Four channels of EMI filtering, supports bipolar signals—ideal for audio applications Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Includes 1 channel of ESD-only protection Greater than 30dB attenuation at 1GHz ±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge);±15kV ESD protection on each channel (HBM) 11-bump, 2.045mm X 1.437mm footprint.Chip Scale Package(CSP) 0.5mm Pitch. Chip Scale Package features extremely low lead inductance for optimum filter and ESDperformance EMI filtering and ESD protection for audi o ports Wireless Handsets Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders, Desktop PCs, Notebooks SHORT PRODUCT APPLICATION NOTE SWPIEMI200 is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the SWPIESD-4 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The SWPIEMI200 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight., SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. ABSOLUTE MAXIMUM RATINGS Reverse voltage VR Continuous IF IFRM for tw<100ms Max Power dissipation 7V 100mA 200 mA (20%duty cycle) 100mW@70°C/channel Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTICS PARAMETER VALUE UNITS Storage Temperature Range -65 to +150 °C Operating Temperature Range -40 to +85 °C DC Power per Resistor 100 mW DC Package Power Rating 400 mW Resistance Tolerance max.±10 % Capacitance Tolerance max.±20 % Signal Voltage, Positive Clamp,ILOAD = 10mA Signal Voltage,Negative Clamp min.5 ; typ.7; max.15 min.-5;typ.-10;max.-15 V V In-system ESD Withstand Voltage,Notes 2,4 and 5 a) Human Body Model, MIL-STD-883,Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 min.±15 min.±8 kV kV Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV;Notes 2,3,4 and 5 Positive Transients Negative Transients typ. +15 typ. -19 V V Note 1: T A =25°C unless otherwise specified Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design and characterization. GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal SiO2 / Silicon 15±2 80.6 x 56.5±3 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach. All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. DIODES RESISTORS CAPACITORS The diodes offer basic ESD protection, with low forward voltage, low leakage and low power dissipation in OFF state.Diodes exhibit low junction capacitance CTand low on resistance RDON. Ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.



SEMICONWELL Integrated Passive Networks		4 CHANNEL MICROPHONE AND HEADSET EMI FILTER SWPIEMI200-CSP

FEATURES

APPLICATIONS

SCHEMATIC

Four channels of EMI filtering, supports bipolar signals—ideal for audio applications

Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network

Includes 1 channel of ESD-only protection

Greater than 30dB attenuation at 1GHz

±8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge);±15kV ESD protection on each channel (HBM)

11-bump, 2.045mm X 1.437mm footprint.Chip Scale Package(CSP) 0.5mm Pitch. Chip Scale Package features extremely low lead inductance for optimum filter and ESDperformance

EMI filtering and ESD protection for audi o ports

Wireless Handsets

Handheld PCs / PDAs

MP3 Players

Digital Camcorders, Desktop PCs, Notebooks

SHORT PRODUCT APPLICATION NOTE

SWPIEMI200 is a quad low-pass filter array integrating four pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains 3 different filter values. Each high quality filter provides more than 20dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the SWPIESD-4 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The SWPIEMI200 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight.,

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION

Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

ABSOLUTE MAXIMUM RATINGS
Reverse voltage V_R	Continuous I_F	I_FRM for t_w<100ms	Max Power dissipation
7V	100mA	200 mA (20%duty cycle)	100mW@70°C/channel

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS
PARAMETER	VALUE	UNITS
Storage Temperature Range	-65 to +150	°C
Operating Temperature Range	-40 to +85	°C
DC Power per Resistor	100	mW
DC Package Power Rating	400	mW
Resistance Tolerance	max.±10	%
Capacitance Tolerance	max.±20	%
Signal Voltage, Positive Clamp,I_LOAD = 10mA Signal Voltage,Negative Clamp	min.5 ; typ.7; max.15 min.-5;typ.-10;max.-15	V V
In-system ESD Withstand Voltage,Notes 2,4 and 5 a) Human Body Model, MIL-STD-883,Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4	min.±15 min.±8	kV kV
Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV;Notes 2,3,4 and 5 Positive Transients Negative Transients	typ. +15 typ. -19	V V
Note 1: T A =25°C unless otherwise specified Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design and characterization.

GENERAL DIE INFORMATION
Substrate	Thickness (mils)	Die size (mils)	Bonding pads	Backside metal
SiO₂ / Silicon	15±2	80.6 x 56.5±3	4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier	Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

DIODES	RESISTORS	CAPACITORS
The diodes offer basic ESD protection, with low forward voltage, low leakage and low power dissipation in OFF state.Diodes exhibit low junction capacitance C_Tand low on resistance R_DON.	Ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%.	Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.

DIE LAYOUT	PACKAGE PIN OUT

STANDARD PRODUCTS ORDERING INFORMATION

R1(W)	C1(pF)	R2(W)	C2(pF)	R3(W)	C3(pF)	R4(W)	C4(pF)	CSP-11
100	47	68	47	10	100	10	100	SWPIEMI200-11CSP

SW PART #	QUANTITY	CSP-11	U/P($)	U/P($)	U/P($)
SWPIEMI200	5,000pc	-11CSP		-11BD
SWPIEMI200	10,000pc	-11CSP		-11BD

For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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