PAC27A02 same as SWRV2 PRECISION VOLTAGE DIVIDER NETWORK manufactured by SEMICONWELL, VOLTAGE DIVIDERS,VOLTAGE DIVIDER NETWORKS-SEMICONWELL - Thin film Precision voltage divider network SOT 23 Voltage divider, Precision voltage dividers network SWRV2 XXX/XXX series. Voltage divider SWRV2-xx/xx is available in wide resistance range 10 ohm to 1 meg ohm , tolerance ±0.1%, ratios ±0.05% Low temperature coefficient ±25ppm/°C Long term stability, 0.05% after 1000 hours Voltage dividers are available in any custom values and configuration. Applications include Precision voltage dividers, OP AMP gain control Attenuation Pull-up/pull-down TTL/MOS interfacing Precision voltage divider resistor array offers a high degree of stability, low noise and the proven reliability characteristics of Tantalum Nitride. These devices are manufactured using advanced Thin Film Technology. A wide range of resistor values is available, as well as various tolerances and TCRs. Integrated passive networks are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1Ω/sq to 10,000 Ω/sq. All Semiconwell's products are available in die form and are ideal for high reliability hybrid and multi chip module applications. |
SEMICONWELL
Integrated Passive Networks |
THIN FILM PRECISION VOLTAGE DIVIDER NETWORK SWRV2/RXXX/RXXX/RXXX |
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SHORT PRODUCT APPLICATION NOTE |
Precision voltage divider resistor array offers a high degree of stability, low noise and the proven reliability characteristics of Tantalum Nitride. These devices are manufactured using advanced Thin Film Technology. A wide range of resistor values is available, as well as various tolerances and TCRs. |
SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION |
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 Ω/sq to 10,000 Ω/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
RESISTOR SPECIFICATIONS | ||
Capacitance [pF] | Tolerance q [%] | Power Rating [mW] |
<5pF | 1, 5 | 25 mW@70°C |
Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. |
ELECTRICAL CHARACTERISTICS | ||
PARAMETER | VALUE | UNITS |
Resistor standard values R1 R2 R3 |
1150 1350 1000 |
Ω Ω Ω |
Ratio Tracking (0 to +70°C) , Voltage per resistor<10V and power resistor <25mW R1/R2 (R1+R2)/R3 |
±1.0 ±0.25 |
% % |
TCR, -55 to +125 °C | max.±100 | ppm/°C |
Operating Voltage,0 to +70°C | max 100 | Vdc |
Power Rating (per resistor) @70°C (Derate linearly to zero @150°C) | max 125 | mW |
Thermal Shock, Method 107 MIL-STD-202F | max ±0.5 | % @DR |
High Temperature Exposure,100Hrs@150°C Ambient | max ±0.25 | % @DR |
Moisture Resistance, Method 106 MIL-STD-202F | max ±0.5 | % @DR |
Life, Method 108 MIL-STD-202F (125°C/1000hr) | max ±0.5 | % @DR |
Noise, Method 308 MIL-STD-202F | max -25 | dB |
For R>250kΩ | typ. -20 | dB |
Resistor Tap Tolerance (R1/R2 @25°C) | ±1 | % |
Insulation Resistance @25°C | min 1012 | Ω |
GENERAL DIE INFORMATION | ||||
Substrate | Thickness (mils) | Die size (mils) | Bonding pads | Backside metal |
SiO2 / Silicon | 10±2 | 35 x 35 ±3 | 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier | Au/Si compatible with eutectic and conductive epoxy die attach. |
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. |
CONDUCTORS | RESISTORS | BACKSIDE METAL |
The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. | Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10Ω/sq and Rsq>500Ω/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KΩ and 25mW for R>1KΩ. Standard tolerance is ±5%. | Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only. |
DIE LAYOUT | PACKAGE PIN OUT |
STANDARD PRODUCTS ORDERING INFORMATION |
R1(Ω) | R2(Ω) | R3(Ω) | R CODE | SOT23 | BARE DIE |
1150 | 1350 | 1000 | 1150/1350/1000 | SWRV2/R1150/R1350/R1000-SOT143 | SWRV2/R1150/R1350/R1000-BD |
10 to 10M | 10 to 10M | 10 to 10M | /XXX/XXX/XXX | SWRV2/XXX/XXX-ST | SWRV2-XXX/XXX-BD |
SW PART # | QUANTITY | SOT143 | U/P($) | BARE DIE | U/P($) |
SWRV2/RCODE-10% | 5,000pc | -SOT143 | -BD | ||
SWRV2/RCODE-10% | 10,000pc | -SOT143 | -BD | ||
SWRV2/RCODE-5% | 5,000pc | -SOT143 | -BD | ||
SWRV2/RCODE-5% | 10,000pc | -SOT143 | -BD | ||
SWRV2/RCODE-1% | 5,000pc | -SOT143 | -BD | ||
SWRV2/RCODE-1% | 10,000pc | -SOT143 | -BD | ||
For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com |
Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. |
Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. |
SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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