SCSI Termination resistor networks , SCSI terminator resistor networks, Stable resistor network 9 lines/package Saves board space and reduces assembly cost Available in standard 20 pin TSSOP, QSOP, SOIC SCSI termination TTL to ECL translatorPrinters, disk drives and CD-ROMís are connected to host through SCSI (Small Computer System Interface). The signals transmitted through the SCSI cable can generate ringing on the bus. The terminating resistor network reduces unwanted reflections on the transmission line. The resistors used for terminating the transmission lines are noiseless, stable and functional at high frequencies. These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high-speed data lines. These products are manufactured using advanced thin film technologies including ultra-stable and selfpassivating Tantalum Nitride resistors and gold interconnect metalization to achieve excellent uniformity, perform ance and reliability. In die form, these products are ideal for hybrid and multichip module applications. In packaged form, these products are the best solution where space and weight are a concern.

 
 
SEMICONWELL
Integrated Passive Networks
  SCSI TREMINATION RESISTOR NETWORKS
SWRSOG-24
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Stable resistor network
11 lines/package
Saves board space and reduces assembly cost
Available in standard 20 pin TSSOP, QSOP, SOIC
SCSI termination
TTL to ECL translator
schematic

SHORT PRODUCT APPLICATION NOTE
Printers, disk drives and CD-ROMís are connected to host through SCSI (Small Computer System Interface). The signals transmitted through the SCSI cable can generate ringing on the bus. The terminating resistor network reduces unwanted reflections on the transmission line. The resistors used for terminating the transmission lines are noiseless, stable and functional at high frequencies. These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high-speed data lines. These products are manufactured using advanced thin film technologies including ultra-stable and selfpassivating Tantalum Nitride resistors and gold interconnect metalization to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multichip module applications. In packaged form, these products are the best solution where space and weight are a concern.

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 Ω/sq to 10,000 Ω/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW]
<5pF 1, 5 50 mW@70°C

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.


GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 / Silicon 10±2 90 x 60 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

CONDUCTORS RESISTORS BACKSIDE METAL
The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Resistive material is ultra stable TaN with low TCR <75ppm/įC typical. For Rsq<10Ω/sq and Rsq>500Ω/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KΩ and 25mW for R>1KΩ. Standard tolerance is ±5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only.

DIE LAYOUT PACKAGE PIN OUT
layout schematic
Vin=1,2,..,11
Vout=23,22,...13
Vss=12
Vdd=24

STANDARD PRODUCTS ORDERING INFORMATION

R1(Ω)* R2(Ω)* R3(Ω)* R  CODE QSOP-24 TQSOP-24 TSSOP-24 BARE DIE-24
330 150 330 331/151/331 SWRSOG/RCODE-24QS SWRSOG/RCODE-24TQS SWRSOG/RCODE-24TS SWRSOG/RCODE-24BD
330 150 330 331/151/331 SWRSOG/RCODE-24QS SWRSOG/RCODE-24TQS SWRSOG/RCODE-24TS SWRSOG/RCODE-24BD
330 150 330 331/151/331 SWRSOG/RCODE-24QS SWRSOG/RCODE-24TQS SWRSOG/RCODE-24TS SWRSOG/RCODE-24BD
 
* Ī 5% tolerance

SW PART # QUANTITY QSOP-24 U/P($) TQSOP-24 U/P($) TSSOP-24 U/P($) BARE DIE U/P($)
SWRSOG/RCODE-5%      5,000pc -24QS   -24TQS   -24TS   -24BD  
SWRSOG/RCODE-5%    10,000pc -24QS   -24TQS   -24TS   -24BD  
For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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