Zero ohms jumpers resistors.SWR0J series of zero ohm jumper resistor arrays is available in SOT-23, DIP, QSOP,SOIC,TSSOP compatible with PRN 146, PRN 147 and other. Isolated Zero Ohms Jumpers crossovers surface mount network array. Semiconwell's integrated isolated Zero ohms Jumper arrays networks are designed to be used in a wide range of
applications including PC Board crossovers, permanent jumpers, program, customize or alter functionality of a PC Board. Due to a very low capacitance between jumpers, these can be used also on high-speed data lines. The R0J series solution saves board space, improves PC Board performance and reduces assembly cost on passive components. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883Isolated Zero Ohms Jumpers SW R0J-14
10 mOhms jumpers network 7 isolated jumpers/package Available in standard 14 pin TSSOP, QSOP, SOIC Custom configurations are available Parallel terminations Series termination Pull up / Pull down resistors Encoding / Decoding Digital pulse squaring PRODUCT DESCRIPTION Semiconwell's integrated thin film resistor-networks are designed to be used in a wide range of applications including pull up, pull down, voltage dividers or to suppress transmission line effects on high-speed data lines. The RI series
solution improves performance and reduces assembly cost on passive components. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold
interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1Ω/sq to 10,000 Ω/sq. All Semiconwell's
products are available in die form and are ideal for high reliability hybrid and multi chip module applications. SUBSTRATE INFORMATION RESISTOR SPECIFICATIONS Material Thickness (mil) Min. die size (mils) Power rating Tolerance q % Capacitance SiO2 / Silicon 10±2 90 x 60 ±3 50 mW@70°C 1, 5, 10 <5pF RESISTORS CONDUCTORS BACKSIDE METALS Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10Ω/sq and Rsq>500Ω/sq,
the resistive material is proprietary. Power rating/resistor max 100mW for R<1KΩ and 25mW for R>1KΩ. Standard tolerance is ±5%. The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon
special request for die products only. Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage
divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF)
and giga ohms resistors (GΩ).
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