SW FCRN1812N-FC FLIP CHIP 1812 PRECISION THIN FILM RESISTOR     SEMICONWELL Integrated Passive Networks   CHIP SCALE 1812 PRECISION THIN FILM RESISTOR SWFCRN1812N-FC     FEATURES APPLICATIONS SCHEMATIC Standard 1812 Format SMD chips Absolute tolerance 0.1% Temperature Coeficient (TCR) of min 25 ppm/°C Ceramic substrate Voltage dividers Current sensing Current limiting Precision gain setting SHORT PRODUCT APPLICATION NOTE The SWFCRN1812N-xx-FC resistors offer a high degree of stability and low noise as well as the proven reliability characteristics of Tantalum Nitride and NiCr. The SWFCRN1812 Series offers the advantages of solder ability similar to a CSP ( Chip Scale Package). However, the design is better described as Flip Chip [-FC] The devices are built on ceramic with 0.5um gold over a Nickel termination for direct placement onto printed circuit boards. Termination size and location are compatible with 1812 footprint. The resistive element for all SWFCRN1812N-xx-FC series is protected by a thin layer of dielectric. . SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W /sq to 10,000 W /sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern. RESISTOR SPECIFICATIONS Capacitance [pF] Tolerance q [%] Power Rating [mW] <1.21 pF 5, 2, 1, 0.5, 0.1 500 mW@70°C Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTICS PARAMETER VALUE UNITS Resistor Range 40 to 150,000 W Resistor Tolerance min ±0.1 % Operating Voltage max. 200 Vdc MaximumResistor Power,at 70°C 0.5 W Temperature Coefficient of Resistance ±100 ppm/°C Storage Temperature Range -65°C to +150 °C Operating Temperature Range -55°C to +155 °C GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Al2O3 99.6 % 25±2 177x126±5 min 4x4 mils, 0.5 m m thick, pure gold over nickel compatible with pure Sn or SnPb solder All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products. CONDUCTORS RESISTORS BACKSIDE METAL Gold Pad Height 1µm Pad Size 20x121 mils Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10 W /sq and Rsq>500 W /sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1K W and 25mW for R>1K W . Standard tolerance is ±5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only. CASE LAYOUT PACKAGE PIN OUT Dimensions are in mils [µm] STANDARD PRODUCTS ORDERING INFORMATION SW PART # QUANTITY U/P($) SWFCRN1812N/RCODE-1%-FC   5,000pc   SWFCRN1812N/RCODE-1%-FC 10,000pc   For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts. Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. Home Product Tree Tech. Support Print PDF Packages Request Quote Inventory Place Order Contact sales Home > Thin Film Resistor Arrays > Last updated:   SEMICONWELL www.semiconwell.com Tel:(408)986-8026 Fax:(408)986-8027   ©1990- SEMICONWELL All rights reserved. No material from this site may be used or reproduced without permission.

 
 
SEMICONWELL
Integrated Passive Networks
  CHIP SCALE 1812 PRECISION THIN FILM RESISTOR
SWFCRN1812N-FC
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Standard 1812 Format
SMD chips
Absolute tolerance 0.1%
Temperature Coeficient (TCR) of min 25 ppm/°C
Ceramic substrate
Voltage dividers
Current sensing
Current limiting
Precision gain setting

SHORT PRODUCT APPLICATION NOTE
The SWFCRN1812N-xx-FC resistors offer a high degree of stability and low noise as well as the proven reliability characteristics of Tantalum Nitride and NiCr. The SWFCRN1812 Series offers the advantages of solder ability similar to a CSP ( Chip Scale Package). However, the design is better described as Flip Chip [-FC] The devices are built on ceramic with 0.5um gold over a Nickel termination for direct placement onto printed circuit boards. Termination size and location are compatible with 1812 footprint. The resistive element for all SWFCRN1812N-xx-FC series is protected by a thin layer of dielectric. .

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

RESISTOR SPECIFICATIONS
Capacitance [pF] Tolerance q [%] Power Rating [mW]
<1.21 pF 5, 2, 1, 0.5, 0.1 500 mW@70°C

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Resistor Range
40 to 150,000
W
Resistor Tolerance
min ±0.1
%
Operating Voltage
max. 200
Vdc
MaximumResistor Power,at 70°C
0.5
W
Temperature Coefficient of Resistance
±100
ppm/°C
Storage Temperature Range
-65°C to +150
°C
Operating Temperature Range
-55°C to +155
°C

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads
Al2O3 99.6 % 25±2 177x126±5 min 4x4 mils, 0.5 mm thick, pure gold over nickel compatible with pure Sn or SnPb solder
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

CONDUCTORS RESISTORS BACKSIDE METAL
Gold Pad Height 1µm
Pad Size 20x121 mils
Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Backside of the die is metallized with standard Si/Au compatible with eutectic and epoxy die attach. Custom metallizations are available upon special request for die products only.

CASE LAYOUT PACKAGE PIN OUT
1812 case chip size
Dimensions are in mils [µm]

STANDARD PRODUCTS ORDERING INFORMATION

R R multiplier TOLERANCE
Find part #

SW PART # QUANTITY U/P($)
SWFCRN1812N/RCODE-1%-FC   5,000pc  
SWFCRN1812N/RCODE-1%-FC 10,000pc  
For custom products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

INSTANT QUOTE
Semiconwell P/N Quantity E-mail    
 

Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

Home Product Tree Tech. Support Print PDF Packages Request Quote Inventory Place Order Contact sales