IC Packaging services for Semiconwell board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

 


SEMICONWELL
Integrated Passive Networks
SEMICONWELL STANDARD SMALL OUTLINE TRANSISTOR PACKAGE INFORMATION
   
   
SOT 23 - SMALL OUTLINE TRANSISTOR PACKAGE SC70-4 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT143 - SMALL OUTLINE TRANSISTOR PACKAGE SOT326, SC70-6 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT223 - SMALL OUTLINE TRANSISTOR PACKAGE SC70-8 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT25 - SMALL OUTLINE TRANSISTOR PACKAGE SC90 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT26 - SMALL OUTLINE TRANSISTOR PACKAGE SOT89 - SMALL OUTLINE TRANSISTOR PACKAGE
SOT323, SC70-3 - SMALL OUTLINE TRANSISTOR PACKAGE SOT66 - SMALL OUTLINE TRANSISTOR PACKAGE
 
 

SMALL OUTLINE TRANSISTOR SOT package is a rectangular surface mount transistor or diode with three or more gull wings leads. The leads are on two length sides of the package. SOT package are JEDEC compliant. Popular sizes are the SOT23, SOT143, SOT223 and SOT89. SOT components are available on plastic tape and reel.
IC Packaging services for Semiconwell board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.
   

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