SEMICONWELL - SSOP SHRINK SMALL OUTLINE PACKAGE

SSOP SHRINK SMALL OUTLINE PACKAGE - The SSOP package body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC package. Lead counts range from 8 to 64. Body sizes are 209 and 300 mils. The SSOP package is JEDEC and EIAJ compliant. The package leads are solder plated.



SEMICONWELL Integrated Passive Networks		SHRINK SMALL OUTLINE PACKAGE SSOP

PACKAGE OUTLINE

SHORT PACKAGE DESCRIPTION

SYMBOL	COMMON DIMENSION [inch]
MIN	NOM	MAX
A	.068	1.73	.073	1.86	.078	2.00
A1	.002	.05	.13	.008	.20
A2	.065	1.65	.069	1.75	.073	1.85
b	.009	.22	.012	.30	.015	.38
b1	.009	.22	.012	.30	.013	.33
c	.004	.09	.006	.15	.010	.25
c1	.004	.09	.006	.15	.008	.21
D	SEE VARIATIONS
E	.291	7.40	.307	7.80	.323	.820
E1	.197	5.00	.209	5.30	.221	.560
e	.026 INCH 0.65 MM BSC
L	.022	.55	.030	.75	.037	.95
N (Leads)	SEE VARIATIONS
R	.004	.09
a	0	4	8

VARIATIONS	D	Leads
MIN	NOM	MAX
[INCH]	[MM]	[INCH]	[MM]	[INCH]	[MM]
AE	.271	6.90	.283	7.20	.295	7.50	20
AG	.311	7.90	.323	8.20	.334	8.50	24
AH	.390	9.90	.402	10.20	.413	10.50	28

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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