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UB02CSP05B same as SWTVS-CSP-05BU SINGLE TRANSIENT VOLTAGE SUPRESSOR 5V, 0402 SMD, 2 CONTACTS manufactured by SEMICONWELL
SINGLE TRANSIENT VOLTAGE SUPRESSOR 5V, 0402 SMD, 2 CONTACTS SWTVS-CSP-05BUC
FEATURES Single channel voltage suppressor in a surface mount EIA standard 0402-sezed device Compact 0402 size saves board space and eases layout in area critical applications compared to traditional wire bonded IC packages
In-system ESD protection to ±30KV contact discharge per IEC 61000-4-2 International ESD Standard Only 1nA leakage at 3.3V (typical)
APPLICATIONS Cell phones Wireless Handsets Palmtop PCs Handheld PCs / PDAs Notebook PCs Set-top box audio and video ports
SHORT PRODUCT APPLICATION NOTE
The SWTVS-CSP-05BUC is a transient voltage suppressor that is ideal for very high level protection for sensitive 5V electronic components that may be subjected to electrostatic discharge (ESD). The bipolar configuration provides symetrical ESD protection in cases where nodes with AC signals are present. The devices is designed and characterized to safely dissipate ESD strikes at ±30KV contact discharge, well beyond the maximum requirements of the IEC 61000-4-2 international standard (Level 4, 8KV contact discharge). Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, signals pins are protected for contact discharges to greater than ±30KV.
SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.
ABSOLUTE MAXIMUM RATINGS Storage Temperature Range -65 to +150 °C
STANDARD OPERATING CONDITIONS Operating Temperature Range -40 to +85 °C
Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.
ELECTRICAL CHARACTERISTICS , TA=-40 to 85 °C unless otherwise specified
PARAMETER VALUE UNITS
Reverse Stand-off Voltage , I=10mA min ±5.9 V
Diode Leakage Current, 3.3V across the device,TA=25 °C typ. 1 max 100 nA
Signal Clamp Voltage, ILOAD=10mA
Positive Clamp min. 6.0 typ. 7.5 max. 9.2 V
Negative Clamp min. -9.2 typ. -7.5 max. -6.0 V
In-system ESD Withstand Voltage,Note 2
a)Human Body Model, MIL-STD-883,mETHOD 3015
b)Contact Discharge per IEC 61000-4-2 Level 4
min.±30 V
min. ±30 V
Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8KV , Note 2
Positive Transients
Negative Transients
typ. +13 V typ. -13 V
Capacitance, VIN=0V DC, f=1MHz typ. 45 max. 65 pF
GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 / Silicon 10±2 90 x 60 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.
DIODES RESISTORS CAPACITORS The diodes offer basic ESD protection, with low forward voltage, low leakage and low power dissipation in OFF state. Ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.
For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com
Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.
Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.
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