VSOP SMALL OUTLINE PACKAGE The VSOP package body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC package. Lead counts range from 8 to 64. Body sizes are 209 and 300 mils. The VSOP package is JEDEC and EIAJ compliant. The package leads are solder plated.

 
 
SEMICONWELL
Integrated Passive Networks
  VERRY SMALL OUTLINE PACKAGE
VSOP 40, 48
 
 

PACKAGE OUTLINE

VERRY SMALL OUTLINE PACKAGE

SHORT PACKAGE DESCRIPTION
VSOP SMALL OUTLINE PACKAGE The VSOP package body size is compressed and the lead pitch is tightened to obtain a small version of the standard SOIC package. Lead counts range from 8 to 64. Body sizes are 209 and 300 mils. The VSOP package is JEDEC and EIAJ compliant. The package leads are solder plated.

VSOP VERRY SMALL OUTLINE PACKAGE
JEDEC # MO - 154BB MO - 154AB
TYPE 40 LEAD 48 LEAD
SYMBOL Min.[mils] Max.[mils] Min.[mils] Max.[mils]
A 0.059 0.069 0.059 0.069
A1 0.004 0.008 0.004 0.008
B 0.0067 0.009 0.0051 0.008
C 0.0075 0.0098 0.0075 0.0098
D 0.386 0.394 0.386 0.394
E 0.150 0.157 0.150 0.157
e 0.0197 BCS 0.5 mm 0.0157 BCS 0.4 mm
H 0.228 0.244 0.228 0.244
h 0.010 0.016 0.010 0.016
L 0.023 0.029 0.023 0.029
a 0 8 0 8

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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