|PAC DN042 PACDN042 PACDN042Y3 PACDN042YB3 compatible, SWZDN42-SOT23-3, u/p=$0.25 in 10k pc. SWZDN042 is a transient voltage suppressor array that provides a very high level of protection for sensitive electronic components which may be subjected to electrostatic discharge (ESD). The SWZDN042 is designed and characterized to safely dissipate ESD strikes that esceed IEC 61000-4-2 specification International Standard Level 4 (8kV contact discharge). All pins of SWZDN042 are rated to withstand 20kV ESD pulses using IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method3015) specification for Human Body Model (HBM) ESD, all pins are protected from contact discharges of grater than 30kV.
Integrated Passive Networks
TRANSIENT VOLTAGE SUPPRESSORS
|SHORT PRODUCT APPLICATION NOTE
|The SWZDN042 is a transient voltage suppressor array that provides a very high level of protection for sensitive electronic components which may be subjected to electrostatic discharge (ESD). The SWZDN042 is designed and characterized to safely dissipate ESD strikes that exceed IEC 61000-4-2 specification International Standard Level 4 (8kV contact discharge). All pins of SWZDN042 are rated to withstand 20kV ESD pulses using IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method3015) specification for Human Body Model (HBM) ESD, all pins are protected from contact discharges of grater than 30kV..
|SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
|Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.
|ABSOLUTE MAXIMUM RATINGS
|Package Power Dissipation
|Operating Temperature Range
|Storage Temperature Range
|0.2W/SC70 and 0.225W/SOT23
|-40°C to 85°C
|-65°C to 150°C
|Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.
|Capacitance (C) TA = 25°C, 2.5VDC, 1MHz
|Reverse Stand-off Voltage:
IR = 10µA, TA = 25°C
IR = 1mA, TA = 25°C
|Leakage Current VIN = 5.0VDC, TA=25°C
| Small Signal Clamp Voltage
Positive Clamp I = 10mA, TA=25°C
Negative Clamp I = -10mA, TA=25°C
min.6.2 typ.6.8 max.8
min.-0.4 typ.-0.8 max. -1.2
| ESD Withstand Voltage
Human Body Model, MIL-STD-883, Method 3015 (Note1)
Contact Discharge per IEC 61000-4-2 standard (Note2)
| Clamping Voltage during ESD Discharge (MIL-STD-883D, Method3015)
|Diode Dynamic Resistance
|GENERAL DIE INFORMATION
|Die size (mils)
|43 x 82 ±3
|4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier
|Au/Si compatible with eutectic and conductive epoxy die attach.
|All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.
|The diodes provide a very high level of protection at electrostatic discharge (ESD).
|Ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%.
|Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.
|PACKAGE PIN OUT
|VARIES AS A FUNCTION OF PACKAGE
|STANDARD PRODUCTS ORDERING INFORMATION
|SW PART #
|For special packaging or custom configurations, contact email@example.com
|Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.
|Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.
|SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.
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