News Release from: Semiconwell
Edited by the Electronicstalk Editorial Team on 5 February 2003
Semiconwell has developed a new line of 9- and 27-channel surface mount LVD resistive networks designed for high-performance active termination of SCSI networks compliant with SPI-2 (Ultra2), SPI-3 (Ultra3) and beyond. Manufactured on ceramic substrates, these devices virtually eliminate channel
capacitance and lead inductance, the primary cause of reduced system performance. The LVD SCSI is packaged in a moulded lead frame package (MLP) which offers greater reliability than the exposed resistors of a BGA version.
The MLP package is also smaller than BGA, does not require special assembly equipment and is easy to rework and repair at board level.
A typical existing BGA version occupies 90,000mil2 of PCB area for every nine channels.
The new 20-pin nine-channel device, the SWRSCSI-20ML5, occupies only 25,200mil2 of board area.
And the 27-channel, 56-pin SWRSCSI-56ML13 uses only 102,400mil2 of board, compared with 270,000mil2 necessary for three BGA devices.