SINGLE CHANNEL AND MULTI CHANNEL ESD PROTECTION ARRAYS TRANSIENT VOLTAGE SUPPRESSORS NETWORKS FROM SEMICONWELL
SLVU2.4-4 same as SW SLVU2.8-4, SWSLVU2.8-4
PAC DN2404C, PAC DN2408C, PAC DN2416C, PACDN2404C, PACDN2408C, PACDN2416C same as SW TVS18KV-5, SW TVS18KV-9, SW TVS18KV-17, SWTVS18KV-5, SW TVS18KV-9, SWTVS18KV-17,
PAC DN1404C, PACDN1404C, PAC DN1408C, PACDN1408C, PAC DN1416C, PACDN1416C same as SW TVS25KV-4, SWTVS25KV-4, SW TVS25KV-8, SWTVS25KV-8, SW TVS25KV-16, SWTVS25KV-16,
PAC DN027, PACDN027 same as SW TVS30KV, SWTVS30KV, B02CSP05B same as SWTVS-CSP-05B, UB02CSP05B SWTVS-CSP-05BU, PAC DN3401C, PACDN3401C, SW DN3401, SWDN3401, PAC DN3402C, PACDN3402C, SW DN3402, SWDN3402
Semiconwell's transient voltage suppressor arrays provide a very high level of protection for sensitive integrated circuit terminals that may be subjected to electrostatic discharge (ESD). The back-to-back zener connections provide ESD protection in cases where nodes with AC signals are present. The SWTVS are designed and characterized to safely dissipate ESD strikes al levels well beyond the maximum requirements set forth in the IEC61000-4-2 specification (Level 4,8KV contact discharge). All pins are rated to minimum 18KV using the IEC6100-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30KV.
Semiconwell manufactures passive network components, integrated active and passive devices,
resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film
resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors
networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead
frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW).