DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK Suitable for I/O interface cards Multiple EMI/RFI protection lines/package Stable resistor-capacitor network Saves board space and component cost ESD protected up to 5kV EMI/RFI Filters Low pass filters RS232 Serial Port Filter These integrated thin film resistor-networks is designed to suppress EMI/RFI noise at I/O ports of personal computers and peripherals, workstations, Local Area Network (LAN), Asynchronous Transfer Mode (ATM), Wide Area Network (WAN), etc. The filter includes ESD protection circuitry witch prevents device destruction when subjected to ESD discharges of up to 5kV. The ESD protection circuitry permits the filter to operate on bipolar signals of up to +12V. These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high-speed data lines. The TESD series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self-passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multi-chip module applications. In packaged form, these products are the best solution where space and weight are a concern. Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW).

 


SEMICONWELL
Integrated Passive Networks
SW DIODE PROTECTED RC TERMINATION NETWORK
SWTFESD-XX-8 8 PIN PACKAGE DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK
SWTFESD-XX-14 14 PIN PACKAGE DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK
SWTFESD-XX-16 16 PIN PACKAGE DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK
SWTFESD-XX-20 20 PIN PACKAGE DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK
SWTFESD-XX-24 24 PIN PACKAGE DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK
SWTFESD-XX-24A 24 PIN PACKAGE Ver. A DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK
SWTFESD-XX-28 28 PIN PACKAGE DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK
 

DIODE PROTECTED RC TF TAPPED FILTER TERMINATION NETWORK is suitable for I/O interface cards Multiple EMI/RFI protection lines/package Stable resistor-capacitor network Saves board space and component cost ESD protected up to 5kV EMI/RFI Filters Low pass filters RS232 Serial Port Filter These integrated thin film resistor-networks is designed to suppress EMI/RFI noise at I/O ports of personal computers and peripherals, workstations, Local Area Network (LAN), Asynchronous Transfer Mode (ATM), Wide Area Network (WAN), etc. The filter includes ESD protection circuitry witch prevents device destruction when subjected to ESD discharges of up to 5kV. The ESD protection circuitry permits the filter to operate on bipolar signals of up to +12V. These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high-speed data lines. The TESD series solution improves performance and reduces assembly cost on passive components. These products are manufactured using advanced thin film technologies including ultra-stable and self-passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multi-chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

   

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