SEMICONWELL
Integrated Passive Networks
| These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high speed data lines. The RCD series solution improves performance and reduces assembly cost on passive components. The RCD series allows the loads to be attached anywhere along the line, with no DC power dissipation. These products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multichip module applications. In packaged form, these products are the best solution where space and weight are a concern. Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). |
SEMICONWELL Integrated Passive Networks |
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These products are integrated thin film resistor-networks that are designed to suppress transmission line effects on high speed data lines. The RCD series solution improves performance and reduces assembly cost on passive components. The RCD series allows the loads to be attached anywhere along the line, with no DC power dissipation. These products are manufactured using advanced thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metalization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. In die form, these products are ideal for hybrid and multichip module applications. In packaged form, these products are the best solution where space and weight are a concern. |
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