IEEE 1284 ECP/EPP Termination Network SWRCD1284, PAC 1284, PACS1284, PACSZ1284, compatible, Single chip IEEE 1284 parallel port termination 28 pin QSOP and TSSOP package, smallest physical solution 17 terminating lines in a single package In system ESD protection to 8KV, HBM In system ESD protection to 4KV per IEC1000-4-2 Protects downstream devices to 30V ECP/EPP Parallel Port termination PC Peripherals Notebook and Desktop computers Engineering Workstations and Servers SHORT PRODUCT APPLICATION NOTE SEMICONWELL' SWRCD1284 Parallel Port Termination Network provides a complete integrated solution for the entire IEEE 1284 interface in a single QSOP and TSSOP package. SWRCD1284 Parallel Port Termination Network are enhanced high-speed parallel ports, conforming to the IEEE 1284 standard and are used to provide communications with external devices such as ZIP drives, printers, parallel port SCSI adapters, tape back-up drives, external LAN adapters, scanners, video capture, and other PC peripherals. These advanced ports support bi-directional transfers to 2MB/sec. To effectively support these higher transfer data rates, the IEEE 1284 standard recommends a combined termination, pull-up filter network between the driver/receiver and the cable at both ends of the parallel port interface. In addition, government EMC compatibility requirements impose strict filtering on the parallel port. SEMICONWELL' SWRCD1284 Parallel Port Termination Network addresses all of these requirements by providing a seventeen line, IEEE 1284 compliant network in a thin film integrated circuit. The device provides a complete parallel port termination solution for space critical applications. All I/O pins are ESD protected for contact discharges up to 4KV per the Human Body Model. The output pins of the device have the highest probability of exposure to ESD pulses so they are protected to 8KV, HBM, thereby providing the necessary robustness for the portís application environment. SEMICONWELL' technology provides high reliability and low cost through manufacturing efficiency. The resistors and capacitors are fabricated using proprietary state-of-the-art thin film technology. SEMICONWELL' solution is silicon-based and has the same reliability characteristics as todayís integrated circuits. SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

 
 
SEMICONWELL
Integrated Passive Networks
  IEEE 1284 ECP/EPP Termination Network
SWRCD1284
 
 

FEATURES
APPLICATIONS
SCHEMATIC
Single chip IEEE 1284 parallel port termination
28 pin QSOP and TSSOP package, smallest physical solution
17 terminating lines in a single package
In system ESD protection to 8KV, HBM
In system ESD protection to 4KV per IEC1000-4-2
Protects downstream devices to 30V
ECP/EPP Parallel Port termination
PC Peripherals
Notebook and Desktop computers
Engineering Workstations and Servers
schematic

SHORT PRODUCT APPLICATION NOTE
SEMICONWELL' SWRCD1284 Parallel Port Termination Network provides a complete integrated solution for the entire IEEE 1284 interface in a single QSOP and TSSOP package. SWRCD1284 Parallel Port Termination Network are enhanced high-speed parallel ports, conforming to the IEEE 1284 standard and are used to provide communications with external devices such as ZIP drives, printers, parallel port SCSI adapters, tape back-up drives, external LAN adapters, scanners, video capture, and other PC peripherals. These advanced ports support bi-directional transfers to 2MB/sec. To effectively support these higher transfer data rates, the IEEE 1284 standard recommends a combined termination, pull-up filter network between the driver/receiver and the cable at both ends of the parallel port interface. In addition, government EMC compatibility requirements impose strict filtering on the parallel port. SEMICONWELL' SWRCD1284 Parallel Port Termination Network addresses all of these requirements by providing a seventeen line, IEEE 1284 compliant network in a thin film integrated circuit. The device provides a complete parallel port termination solution for space critical applications. All I/O pins are ESD protected for contact discharges up to 4KV per the Human Body Model. The output pins of the device have the highest probability of exposure to ESD pulses so they are protected to 8KV, HBM, thereby providing the necessary robustness for the portís application environment. SEMICONWELL' technology provides high reliability and low cost through manufacturing efficiency. The resistors and capacitors are fabricated using proprietary state-of-the-art thin film technology. SEMICONWELL' solution is silicon-based and has the same reliability characteristics as todayís integrated circuits.

SEMICONDUCTOR-THIN FILM MANUFACTURING PROCESS DESCRIPTION
Integrated passive networks are manufactured using advanced thin film technologies including ultra -stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film resistor technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. Semiconwell employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000 W/sq. All Semiconwell's products are available in die form and as KGD, known good die and are ideal for high reliability hybrid and multi chip module applications. Besides thin film resistors, Semiconwell integrates capacitors, Schottky diodes, Zener diodes and transistors. Integrated passive and active networks are manufactured using Semiconwell's in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors and Tantalum Nitride resistors are easily integrated with Schottky diodes to provide complete standard and custom RCD solutions. In die form, these products are ideal for hybrid and multi chip module applications. In packaged form, these products are the best solution where space and weight are a concern.

ABSOLUTE MAXIMUM RATINGS
Reverse voltage VR Continuous IF IFRM for tw<100ms Max Power dissipation
7V 100mA 200 mA (20%duty cycle) 100mW@70°C/channel

Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

SPECIFICATIONS STANDARD
Absolute Tolerance (R)
±10%
Absolute Tolerance (C)
±20%
Operating Temperature Range
0 to 70
°C
Vcc
6 Max
V
Power Rating/Resistor
100
mW
Current Leakage Maximum@ (Vccax) max
1
µA @25°C
Voltage: Clamp Signal :
Clamp Positive
Clamp Negative

>6
<-6

V
V
StorageTemperature
-65 to 150
°C
Package Range Power
max 1.00
W
ESD SPECIFICATIONS
Peak Descharg Voltage at na I/O, Hman Body Model, Method 3015 (Note 1)
min -4; max 4
KV
InSystem Protection, HBM (Note 2)
min -8; max 8
KV
InSystem Protection, IEC 1000-4-2,Level 2 (Note 2,3)
min -4; max 4
KV
Channel Clamp Voltage @ 8KV ESD Pulses, HBM (Note1,2)
min -30; max 30
KV


Note 1:
Human Body Model per MIL-STD-883, Method 3015 C Discharge = 100pF, R Discharge = 1.5 KW, pin 20 @ 5V and pin 22 @ ground.

Note 2: Pin 22 grounded, pin 20 to V CC , all other pins are open. ESD contact discharge between ground and pins 1, 2, 8, 10, 12, 15, 16, 17, 18, 19, 21, 23 through 28, one at a time.
Note 3: Standard IEC 1000-4-2 with C Discharge = 150pF, R Discharge = 330W, pin 20 @ 5V and pin 22 @ ground.

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
SiO2 / Silicon 10±2 90 x 60 ±3 4x4 mils, 3mm thick, 99.99% electroplated gold with a TiW barrier Au/Si compatible with eutectic and conductive epoxy die attach.
All Semiconwell products are available in die form for chip and wire hybrid circuits and multi chip modules applications. Typical delivery for standard die products is 3-4 weeks ARO. For Chip Scale Packaged (CSP) devices consult factory for an update on availability of certain products.

DIODES RESISTORS CAPACITORS
Diodes offers basic ESD protection, with low forward voltage and low power dissipation. Diodes are small physically resulting low junction capacitance and low loading capacitance. Resistive material is ultra stable TaN with low TCR <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. Power rating/resistor max 100mW for R<1KW and 25mW for R>1KW. Standard tolerance is ±5%. Silicon nitride dielectric, MNOS capacitors exhibit high stability, low temperature coefficients, low leakage <10nA and high BV>50V.

DIE LAYOUT PACKAGE PIN OUT
layout schematic
In=3,4,5,6,7,9,11,13,14 OUT=26,25,24,23,21,19,18,17,16
Vch=1,2,8,10,12,15,27,28
Vss=22, die backside
Vdd=20

STANDARD PRODUCTS ORDERING INFORMATION

R1(W) R2(W) C(pF) RC CODE QSOP-28 TSSOP-28
2.2K 33 220 02 SWRCD1284-02-28QS SWRCD1284-02-28TS
4.7K 33 180 04 SWRCD1284-04-28QS SWRCD1284-04-28TS

SW PART # QUANTITY QSOP-28 U/P($) TSSOP-28 U/P($)
SWRCD1284 5,000pc -28QS   -28TS  
SWRCD1284 10,000pc -28QS   -28TS  
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONWELL technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONWELL at any time and without notice.
For products sold as bare tested die or known good die KGD, minimum order is 5000pc. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For special die level KGD requirements, different packaging or custom configurations, contact sw_sales@semiconwell.com

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Delivery for packaged RCD standard products is 6-8 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by Semiconwell sales department in writing before, becoming non cancelable binding contracts.

Semiconwell guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met.

SEMICONWELL has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONWELL for its use, nor for any infringements of rights of third parties which may result from its use. SEMICONWELL reserves the right to revise the content or modify its product line without prior notice. SEMICONWELL products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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Last update: July 18, 2013
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