FLIP CHIP CERAMIC CHIP RESITORS 0201 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 0402 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 0603 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 0805 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 1206 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 1210 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 1506 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 1812 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 2010 GOLD OVER NICKEL TERMINATION
FLIP CHIP CERAMIC CHIP RESITORS 2512 GOLD OVER NICKEL TERMINATION
The SWFCRNxxyy1N-FC resistors offer a high degree of stability and low noise as well as the proven reliability characteristics of Tantalum Nitride and NiCr. The SWFCRNxxyyN-FC Series offers the advantages of solder ability similar to a CSP ( Chip Scale Package). However, the design is better described as Flip Chip [-FC] The devices are built on ceramic with 0.5um gold over a Nickel termination for direct placement onto printed circuit boards. They are compatible with 0x0y footprint. The resistive element for all SWFCRNxxyyN-xx-FC series is protected by a thin layer of dielectric.
Semiconwell manufactures passive network components,
integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC,
Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and
ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow
manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW).