SWFCRN0201N-FC FLIP CHIP CERAMIC CHIP RESITORS 0201 GOLD OVER NICKEL TERMINATION SWFCRN0402N-FC FLIP CHIP CERAMIC CHIP RESITORS 0402 GOLD OVER NICKEL TERMINATION SWFCRN0603N-FC FLIP CHIP CERAMIC CHIP RESITORS 0603 GOLD OVER NICKEL TERMINATION SWFCRN0805N-FC FLIP CHIP CERAMIC CHIP RESITORS 0805 GOLD OVER NICKEL TERMINATION SWFCRN1206N-FC FLIP CHIP CERAMIC CHIP RESITORS 1206 GOLD OVER NICKEL TERMINATION SWFCRN1210N-FC FLIP CHIP CERAMIC CHIP RESITORS 1210 GOLD OVER NICKEL TERMINATION SWFCRN1506N-FC FLIP CHIP CERAMIC CHIP RESITORS 1506 GOLD OVER NICKEL TERMINATION SWFCRN1812N-FC FLIP CHIP CERAMIC CHIP RESITORS 1812 GOLD OVER NICKEL TERMINATION SWFCRN2010N-FC FLIP CHIP CERAMIC CHIP RESITORS 2010 GOLD OVER NICKEL TERMINATION SWFCRN2512N-FC FLIP CHIP CERAMIC CHIP RESITORS 2512 GOLD OVER NICKEL TERMINATION The SWFCRNxxyy1N-FC resistors offer a high degree of stability and low noise as well as the proven reliability characteristics of Tantalum Nitride and NiCr. The SWFCRNxxyyN-FC Series offers the advantages of solder ability similar to a CSP ( Chip Scale Package). However, the design is better described as Flip Chip [-FC] The devices are built on ceramic with 0.5um gold over a Nickel termination for direct placement onto printed circuit boards. They are compatible with 0x0y footprint. The resistive element for all SWFCRNxxyyN-xx-FC series is protected by a thin layer of dielectric. Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW).

 


SEMICONWELL
Integrated Passive Networks
FLIP CHIP RESITORS GOLD OVER NICKEL TERMINATION
SWFCRN0201N-FC FLIP CHIP CERAMIC CHIP RESITORS 0201 GOLD OVER NICKEL TERMINATION
SWFCRN0402N-FC FLIP CHIP CERAMIC CHIP RESITORS 0402 GOLD OVER NICKEL TERMINATION
SWFCRN0603N-FC FLIP CHIP CERAMIC CHIP RESITORS 0603 GOLD OVER NICKEL TERMINATION
SWFCRN0805N-FC FLIP CHIP CERAMIC CHIP RESITORS 0805 GOLD OVER NICKEL TERMINATION
SWFCRN1206N-FC FLIP CHIP CERAMIC CHIP RESITORS 1206 GOLD OVER NICKEL TERMINATION
SWFCRN1210N-FC FLIP CHIP CERAMIC CHIP RESITORS 1210 GOLD OVER NICKEL TERMINATION
SWFCRN1506N-FC FLIP CHIP CERAMIC CHIP RESITORS 1506 GOLD OVER NICKEL TERMINATION
SWFCRN1812N-FC FLIP CHIP CERAMIC CHIP RESITORS 1812 GOLD OVER NICKEL TERMINATION
SWFCRN2010N-FC FLIP CHIP CERAMIC CHIP RESITORS 2010 GOLD OVER NICKEL TERMINATION
SWFCRN2512N-FC FLIP CHIP CERAMIC CHIP RESITORS 2512 GOLD OVER NICKEL TERMINATION
 
 

   

Home>CSP Chip Scale Package Passive> Last updated: July 18, 2013

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