Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). SEMICONWELL is a division of SEMICONIX CORPORATION SEMICONIX CORPORATION designs and manufactures analog devices built on semiconductor linear technology. SEMICONIX CORPORATION Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zener diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE LabsProvides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. USMICROWAVESdevelops, manufactures and supplies high quality standard microwavethin film circuits and microwave devicesincluding RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. |
CONTACTS | REQUEST QUOTE | CROSS REFERENCE | CHECK INVENTORY | CUSTOMER LOGIN | ORDER ONLINE |
RESISTORS NETWORKS | CAPACITORS ARRAY | INDUCTORS ARRAYS | DIODE ARRAYS | ||
RC FILTERS NETWORKS | C - DIODE PROTECTED | LC FILTERS NETWORKS | SCHOTTKY DIODES ARRAYS | ||
RCD TERMINATION ARRAYS | CAPACITORS BINARY | RLC FILTERS ARRAYS | TVS DIODES ARRAYS | ||
POWER RESISTORS | EMI/RFI RC FILTERS | CERAMIC CHIP INDUCTORS | ZENER DIODES ARRAYS | ||
CLOCK TERMINATIONS | MULTILAYER CHIP CAPACITORS | SMD FERRITE INDUCTORS | |||
SMD CHIP RESISTORS | |||||
SEMICONWELL | CUSTOM PASSIVE ICs | CSP CHIP SCALE PASSIVES | COMPUTER PERIPHERALS | ESD PROTECTION | ROHS COMPLIANCE |
Integrated Passive Networks | TF PASSIVES IN DIE FORM | SMD CHIP PASSIVES | PORTABLE ELECTRONICS | COMPLEX DISCRETES | |
Semiconwell offers a broad range of standard IPN devices. For special applications, Semiconwell develops custom products that in reasonable quantities are sold for the same PRICE as similar standard products. Delivery in most cases is same as for similar standard products. Semiconwell is a vertically integrated company that is continuously developing
a broad range of technologies and in-house capabilities. Semiconwell will develop new Technologies when is required by customers for special applications.
Application Specific Networks Products Application specific resistor networks are readily available from SEMICONWELL to provide the designer with optimum performance and cost effective solutions. There are no tooling or engineering charges to supply resistor networks with application specific schematics. Lead times for application specific networks are the same as for standard manufactured product. Application specific networks are available in SWRI, SWRB, SWDT, SWR2R products. Examples of Application Specific Networks:
Application Specific Schematics Resistor values, tolerance, TCR, power rating, and circuit connections are the factors which determine the resistor network design to meet the circuit designers optimum performance and cost goals. The following information is provided to assist you in specifying application specific networks which meet performance requirements at the lowest cost. SEMICONWELL Catalog Schematics SEMICONWELL SWRB Bussed Network Schematic The bussed schematic consists of (N-1) resistors (with N= to the number of pins) of the same value connected to a common buss. These networks are commonly used as pull up/pull down resistors or as impedance matching terminating resistors. They can also be used in other applications where the circuit requires a number of the same value resistors connected to a common point. SEMICONWELL SWRI Isolated Network Schematic The isolated schematic consists of (N/2) resistors of the same value which are electrically isolated from each other. Normally these networks are used as current limiting resistors and termination resistors. They can also be used in other applications where the circuit requires a number of the same value resistors which connect to various points. Since all resistors on the same network are processed identically, the isolated networks have been used to fabricate very accurate voltage dividers at low cost by selectively connecting the resistors in series. SEMICONWELL SWRDT Dual Terminator Network Schematic The dual terminator schematic consists of (2N-2) resistors of two different values with each resistor value connected to a common buss. The resistor values form standard Thevenin equivalent resistance values which are used for termination to two different voltages. These networks are typically used for ECL termination. SEMICONWELL SWR2R R/2R Ladder Network Schematic The R/2R ladder network is commonly used for digital to analog or analog to digital conversions by successive steps. The input signals are applied at each bit of the ladder and the signal is taken from the output terminal where the signal is used to drive an operational amplifier. R/2R ladder networks are available with a ladder accuracy of ±1/2 LSB (least significant bit) up to a maximum of 8 bits and ±1 LSB for 9 bits. |
LC NETWORKS | SWLC | CUSTOM LC FILTERS ARRAYS | SWLCT | LC T FILTER NETWORKS |
THIN FILM INDUCTOR | SWLCPI | LC PI FILTER NETWORKS | --- | --- |
CAPACITOR ARRAYS |
DIODE PROTECTED MOS | SWCDB | BUSSED CAPACITORS DIODE PROTECTED | SWCCD | CUSTOM DIODE PROTECTED MOS CAPACITORS |
CAPACITORS NETWORKS | SWCDI | ISOLATED CAPACITORS & DIODES NETWORKS | --- | --- |
CDX ARRAYS |
APPLICATION NOTES | SWAN701 | FILTERS DESIGN WITH ZENER DIODES | SWAN703 | GTL/ECL GUNNING TRANSCEIVER LOGIC |
INTEGRATED PASSIVE | SWAN702 | LOW PASS FILTERS LC AND RC OVERVIEW | SWAN704 | RESISTOR LADDERS AND D/A CONVERTERS |
NETWORKS |
STANDARD PACKAGES | LIST OF AVAILABLE PACKAGES | SIP | SINGLE INLINE PACKAGE OUTLINE | |
OUTLINE INFORMATION | PDIP | PLASTIC DUAL INLINE PACKAGE | SOIC | SMALL OUTLINE INTEGRATED CIRCUIT-150MIL |
TO | TRANSISTOR OUTLINE PACKAGE | SOICW | SMALL OUTLINE WIDE BODY-300MIL | |
MSOP | MINI SMALL OUTLINE PACKAGE | SOT | SMALL OUTLINE TRANSISTOR PACKAGE | |
MLP | MICRO LEADFRAME, MICRO LEAD FRAME PACKAGE | SSOP | SHRINK SMALL OUTLINE PACKAGE | |
MILLIPAQ | MICRO PACKAGE | TSSOP | THIN SHRINK SMALL OUTLINE PACKAGE | |
QSOP | QUARTER SIZE SMALL OUTLINE PACKAGE | VSOP | VERY SMALL OUTLINE PACKAGE | |
TQSOP | THIN QUARTER SIZE SMALL OUTLINE PACKAGE | FCOL | FLIP CHIP ON LEAD-FRAME | |
SIP | SYSTEM IN PACKAGE | MQFP | METRIC QUAD FLAT PACK PACKAGE | |
SSBGA | SMALL SCALE BALL GRID ARRAY-WIRE BOND | LQFP | LOW QUAD FLAT PACK PACKAGE | |
SSBGA-FC | SMALL SCALE BALL GRID ARRAY-FLIP CHIP | TQFP | THIN QUAD FLAT PACK PACKAGE | |
SDBGA | SMALL SCALE BALL GRID ARRAY-STACKED DIE |