Semiconwell manufactures passive network components, integrated active and passive devices, resistor networks, capacitor networks, schottky and zener diode networks, and npn, pnp transistors arrays that perform the following functions: series and parallel linear and nonlinear GTL, AC, Diode, Thevenin termination networks, precision thin film resistor capacitor networks (RC networks), isolated, bussed resistor networks including zero ohms jumper arrays, voltage divider networks, resistor networks for audio applications, EMI, RFI and ESD zener clamped diodes and transient voltage suppressors networks, EMI/RFI filter networks and clock terminations. Semiconwell's proprietary semiconductor technology, advanced thin films processes, in house assembly and packaging technologies allow manufacturing of flip chip CSP chip scale and MLF molded lead frame surface mount integrated passive networks that include unprecedented large capacitors >1microfarad (1µF) and giga ohms resistors (GW). SEMICONWELL is a division of SEMICONIX CORPORATION SEMICONIX CORPORATION designs and manufactures analog devices built on semiconductor linear technology. SEMICONIX CORPORATION Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zener diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE LabsProvides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. USMICROWAVESdevelops, manufactures and supplies high quality standard microwavethin film circuits and microwave devicesincluding RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe. |
CONTACTS | REQUEST QUOTE | CROSS REFERENCE | CHECK INVENTORY | CUSTOMER LOGIN | ORDER ONLINE |
RESISTORS NETWORKS | CAPACITORS ARRAY | INDUCTORS ARRAYS | DIODE ARRAYS | ||
RC FILTERS NETWORKS | C - DIODE PROTECTED | LC FILTERS NETWORKS | SCHOTTKY DIODES ARRAYS | ||
RCD TERMINATION ARRAYS | CAPACITORS BINARY | RLC FILTERS ARRAYS | TVS DIODES ARRAYS | ||
POWER RESISTORS | EMI/RFI RC FILTERS | CERAMIC CHIP INDUCTORS | ZENER DIODES ARRAYS | ||
CLOCK TERMINATIONS | MULTILAYER CHIP CAPACITORS | SMD FERRITE INDUCTORS | |||
SMD CHIP RESISTORS | |||||
SEMICONWELL | CUSTOM PASSIVE ICs | CSP CHIP SCALE PASSIVES | COMPUTER PERIPHERALS | ESD PROTECTION | ROHS COMPLIANCE |
Integrated Passive Networks | TF PASSIVES IN DIE FORM | SMD CHIP PASSIVES | PORTABLE ELECTRONICS | COMPLEX DISCRETES | |
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LC NETWORKS | SWLC | CUSTOM LC FILTERS ARRAYS | SWLCT | LC T FILTER NETWORKS |
THIN FILM INDUCTOR | SWLCPI | LC PI FILTER NETWORKS | --- | --- |
CAPACITOR ARRAYS |
DIODE PROTECTED MOS | SWCDB | BUSSED CAPACITORS DIODE PROTECTED | SWCCD | CUSTOM DIODE PROTECTED MOS CAPACITORS |
CAPACITORS NETWORKS | SWCDI | ISOLATED CAPACITORS & DIODES NETWORKS | --- | --- |
CDX ARRAYS |
APPLICATION NOTES | SWAN701 | FILTERS DESIGN WITH ZENER DIODES | SWAN703 | GTL/ECL GUNNING TRANSCEIVER LOGIC |
INTEGRATED PASSIVE | SWAN702 | LOW PASS FILTERS LC AND RC OVERVIEW | SWAN704 | RESISTOR LADDERS AND D/A CONVERTERS |
NETWORKS |
STANDARD PACKAGES | LIST OF AVAILABLE PACKAGES | SIP | SINGLE INLINE PACKAGE OUTLINE | |
OUTLINE INFORMATION | PDIP | PLASTIC DUAL INLINE PACKAGE | SOIC | SMALL OUTLINE INTEGRATED CIRCUIT-150MIL |
TO | TRANSISTOR OUTLINE PACKAGE | SOICW | SMALL OUTLINE WIDE BODY-300MIL | |
MSOP | MINI SMALL OUTLINE PACKAGE | SOT | SMALL OUTLINE TRANSISTOR PACKAGE | |
MLP | MICRO LEADFRAME, MICRO LEAD FRAME PACKAGE | SSOP | SHRINK SMALL OUTLINE PACKAGE | |
MILLIPAQ | MICRO PACKAGE | TSSOP | THIN SHRINK SMALL OUTLINE PACKAGE | |
QSOP | QUARTER SIZE SMALL OUTLINE PACKAGE | VSOP | VERY SMALL OUTLINE PACKAGE | |
TQSOP | THIN QUARTER SIZE SMALL OUTLINE PACKAGE | FCOL | FLIP CHIP ON LEAD-FRAME | |
SIP | SYSTEM IN PACKAGE | MQFP | METRIC QUAD FLAT PACK PACKAGE | |
SSBGA | SMALL SCALE BALL GRID ARRAY-WIRE BOND | LQFP | LOW QUAD FLAT PACK PACKAGE | |
SSBGA-FC | SMALL SCALE BALL GRID ARRAY-FLIP CHIP | TQFP | THIN QUAD FLAT PACK PACKAGE | |
SDBGA | SMALL SCALE BALL GRID ARRAY-STACKED DIE |
Headquarters Address | Webmaster: Semiconix Design | Location / Map / Directions | ||
www.semiconwell.com | Fax:(408)986-8027 | http://www.semiconwell.com | ||
United States of America | ||||
SEMICONWELL | SEMICONWELL is a division of SEMICONIX CORPORATION | SEMICONWELL |